Senior Scientist, Copper Plating for Semiconductors

2260 DuPont Electronic Materials International, LLC; Marlborough (MA); Hybrid; USD 120,000 - 180,000; Full time

Job summary

Qnity is seeking a highly motivated Senior R&D Scientist to lead the development of next-generation copper electroplating chemistries for dual damascene interconnects. You will design, formulate, and scale advanced Cu plating chemistries to improve feature filling, reliability, and productivity in semiconductor fabrication.

You will collaborate across electrochemistry, materials science, and customer-facing teams to deliver innovative solutions for memory manufacturers, driving IP and presenting

Qualifications

• PhD in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or related field.
• Strong understanding of electrochemistry and metal electrodeposition principles.
• Experience designing and analyzing statistically driven experiments.
• Record of technical innovation and problem solving.
• Excellent communication and presentation skills.
• Ability to work in a multidisciplinary and customer-facing environment.

Responsibilities

• Lead research and development of advanced copper electroplating chemistries for dual damascene semiconductor interconnect fabrication.
• Design and execute experiments to optimize Cu fill performance in high aspect ratio trenches and vias.
• Partner with Material Innovation to develop novel additive systems and formulation components.
• Investigate plating mechanisms using electrochemical, analytical, and materials characterization techniques.
• Collaborate with process integration, analytical, engineering, and manufacturing teams to accelerate technology development.
• Support scale-up from lab to pilot manufacturing and customer qualification.
• Work directly with leading semiconductor customers to translate requirements into roadmaps.
• Drive programs with global teams and external partners; generate IP via disclosures and publications.
• Present technical results to customers, management, and industry conferences.
• Monitor industry trends in metallization, interconnect scaling, and packaging technologies.

Skills

Electrochemistry

Experiment design & statistics

Communication skills

Problem solving

Cross-functional collaboration

Customer-facing experience

Education

PhD in Chemistry / Chemical Engineering / Materials Science / Electrochemistry

Tools

Cyclic voltammetry

EIS

Chronoamperometry

Chronopotentiometry

Rotating disk electrode

Job description

Qnity is seeking a highly motivated Senior R&D Scientist to lead the development of next-generation copper electroplating chemistries for dual damascene interconnects. You will design, formulate, and scale advanced Cu plating chemistries to improve feature filling, reliability, and productivity in semiconductor fabrication.

You will collaborate across electrochemistry, materials science, and customer-facing teams to deliver innovative solutions for memory manufacturers, driving IP and presenting