Senior Copper Electroplating Scientist for Interconnects

Qnity; Marlborough (MA); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Competitive compensation

Benefits package

Accessibility accommodations

Job summary

Qnity seeks a highly motivated Senior R&D Scientist to lead the development of next-generation copper electroplating chemistries for dual damascene interconnects. You will design and scale advanced Cu plating processes to enable future semiconductor nodes with improved feature filling and reliability.

Partner with cross-functional teams to drive IP generation, customer-facing projects, and manufacturing scale-up from lab to pilot lines. Strong experimental skills and collaboration are essential.

Qualifications

• PhD in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or related field.
• Strong electrochemistry knowledge and metal electrodeposition principles.
• Experience designing and analyzing statistically driven experiments.
• Proven record of technical innovation and problem solving.
• Excellent communication and presentation skills.

Responsibilities

• Lead R&D of copper electroplating chemistries for semiconductor interconnect fabrication.
• Design experiments to optimize Cu fill in high aspect ratio trenches and vias.
• Collaborate with Material Innovation to develop additive systems.
• Investigate plating mechanisms using electrochemical and materials techniques.
• Drive technology development with cross-functional teams and customers.

Skills

Electrochemistry

Statistically driven experiments

Technical communication

Multidisciplinary teamwork

Education

PhD in Chemistry

Tools

Cyclic voltammetry

EIS

Chronoamperometry

Chronopotentiometry

Job description

Qnity seeks a highly motivated Senior R&D Scientist to lead the development of next-generation copper electroplating chemistries for dual damascene interconnects. You will design and scale advanced Cu plating processes to enable future semiconductor nodes with improved feature filling and reliability.

Partner with cross-functional teams to drive IP generation, customer-facing projects, and manufacturing scale-up from lab to pilot lines. Strong experimental skills and collaboration are essential.