Senior Product Engineering Architect - 3D IC

Cadence Design Systems, Inc.; San Jose (CA); On-site; USD 186,000 - 345,000; Full time

Job summary

Cadence Design Systems, Inc. in San Jose seeks a Product Engineering Architect to provide senior technical leadership for the development and proliferation of 3D IC, heterogeneous integration, and advanced packaging technologies.

You will partner with customers, Product Management, R&D, and Field teams to define product strategy, drive innovation, and ensure successful delivery of complex technical solutions.

Qualifications

• BS in Electrical Engineering or related technical field.
• Deep expertise in semiconductor design, physical implementation, advanced packaging, or EDA product engineering.
• Strong hands-on knowledge of the Cadence Virtuoso platform and associated custom IC design flows.
• 15+ years of relevant experience in product engineering, methodology development, or technical leadership.
• Demonstrated ability to shape technical direction and align cross-functional stakeholders around high-value deliverables.
• Proven track record working with strategic customers and deploying advanced design flows.

Responsibilities

• Drive end-to-end solution for system design implementation flows spanning 3D IC and heterogeneous integration.
• Lead strategic customer engagements and guide deployments of advanced design methodologies.
• Influence product roadmap by synthesizing customer requirements, market trends, and technical feasibility.
• Produce PRS, technical use cases, and support R&D during development.
• Provide technical leadership on trade-offs, validation, risk assessment, and prioritization of bugs.

Skills

Semiconductor design

Physical implementation

EDA product engineering

Cadence Virtuoso

Strategic customer engagement

Education

B.S. in Electrical Engineering

Tools

APD+

Package design methodologies

Cadence SKILL language

Job description

Cadence Design Systems, Inc. in San Jose seeks a Product Engineering Architect to provide senior technical leadership for the development and proliferation of 3D IC, heterogeneous integration, and advanced packaging technologies.

You will partner with customers, Product Management, R&D, and Field teams to define product strategy, drive innovation, and ensure successful delivery of complex technical solutions.