Senior Product Engineer: 3DIC & Heterogeneous Packaging

Cadence Design Systems, Inc.

San Jose (CA)

On-site

USD 140,000 - 260,000

Full time

5 days ago
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Job summary

Cadence Design Systems, Inc. in San Jose, CA is seeking a Principal Product Engineer to lead definition, early deployment, and broader adoption of Cadence Virtuoso heterogeneous integration technologies.

You will collaborate across Product Management, R&D, and Field teams to deliver customer-ready capabilities for 3D IC and advanced packaging. The role emphasizes end-to-end system design flows, strong customer engagement, and delivering PRS, use cases, and enablement materials to accelerate

Qualifications

  • BS in Electrical Engineering, Electronics, or a related technical field.

Responsibilities

  • Drive end-to-end solution for system design flows spanning 3D IC, heterogeneous integration and advanced packaging.
  • Partner with leading semiconductor customers to understand co-design challenges and translate them into product specs.
  • Produce high-quality PRS, technical use cases, and support R&D throughout product development.
  • Collaborate cross-functionally with R&D, Product Management, Field teams, Publications and Validation.
  • Create and deliver demonstration collateral, workflows, and enablement materials to accelerate adoption.
  • Troubleshoot design-flow issues, provide technical guidance and workarounds, and drive prioritization of bugs/enhancements.
  • Support product launches, customer engagements, and industry events.
  • Own deliverables from definition through customer deployment with strong execution and accountability.

Skills

Semiconductor design
Physical implementation
3D IC
Heterogeneous integration
Communication skills

Education

BS in Electrical Engineering or related field

Tools

Cadence Virtuoso
Cadence Allegro APD+
SKILL language

Job description

Cadence Design Systems, Inc. in San Jose, CA is seeking a Principal Product Engineer to lead definition, early deployment, and broader adoption of Cadence Virtuoso heterogeneous integration technologies.

You will collaborate across Product Management, R&D, and Field teams to deliver customer-ready capabilities for 3D IC and advanced packaging. The role emphasizes end-to-end system design flows, strong customer engagement, and delivering PRS, use cases, and enablement materials to accelerate

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