Senior Tech Leader, Advanced Packaging & Thin-Film

Intel Corporation; Albuquerque (NM); On-site; USD 164,000 - 232,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Job summary

Intel Corporation's Advanced Packaging group seeks a Senior Technical Leader to drive process innovation in thin-film deposition (CVD, ALD, PVD) for volume manufacturing. You will lead development, optimization, and manufacturability while aligning with customer needs and roadmaps.

You will influence strategies and partner with TD, HVM, and product engineering to ensure robust, scalable manufacturing solutions, with strong cross-functional collaboration and leadership.

Qualifications

• Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or related STEM field with 8+ years in semiconductor industry.
• Bachelor's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or related STEM field with 10+ years in semiconductor industry, focusing on thin-film.
• Proven experience in process development, manufacturing engineering, and technical leadership.
• Experience with leading equipment suppliers and process optimization in high-volume manufacturing.

Responsibilities

• Lead process innovation across thin-film deposition (CVD, ALD, PVD).
• Drive yield, quality, throughput, and cost improvements.
• Optimize equipment performance with internal and supplier partners.
• Develop robust process controls for stable, scalable manufacturing.
• Mentor and develop technical talent; communicate findings to leadership.

Skills

Process optimization

Technical leadership

Cross-functional collaboration

Problem solving

Education

Master's degree in STEM with 8+ years experience

Bachelor's degree in STEM with 10+ years experience

Tools

AMAT

Lam Research

ASM

TEL

Job description

Intel Corporation's Advanced Packaging group seeks a Senior Technical Leader to drive process innovation in thin-film deposition (CVD, ALD, PVD) for volume manufacturing. You will lead development, optimization, and manufacturability while aligning with customer needs and roadmaps.

You will influence strategies and partner with TD, HVM, and product engineering to ensure robust, scalable manufacturing solutions, with strong cross-functional collaboration and leadership.