Senior Process Engineer, Microelectronic Packaging & Transfer

MED Medtronic Inc; Tempe (AZ); On-site; USD 129,000 - 193,000; Full time

Benefits offered by this job

Health, Dental and Vision Insurance

401(k) Plan + employer match

Paid time off

Job summary

Medtronic is seeking a highly experienced Principal Process Engineer to develop and transfer scalable microelectronic packaging processes (PCB Assembly and Wafer Level) into manufacturing. You will optimize underfill, placement, solder paste, reflow, curing, and metrology, while interfacing with upstream/downstream teams to ensure robust, compliant processes.

The role requires advanced knowledge in SPC, DOE, and statistical methods, with a track record in high-volume manufacturing and strong

Qualifications

• Requires a Baccalaureate degree and minimum of 7 years of relevant experience.
• Masters degree with minimum 5 years relevant experience.
• PhD with minimum 3 years relevant experience.

Responsibilities

• Develops manufacturing processes applicable to statistical process control.
• Performs IQ, OQ and PQ validations and gage R&R studies.
• Implements DOE and data-driven improvements.
• Monitors process yield and drives root-cause analysis.
• Collaborates with design teams to transfer processes to manufacturing.
• Ensures compliance with quality system regulations.

Skills

Statistical analysis

DOE

Minitab

JMP

Lean Six Sigma

Education

Baccalaureate degree in engineering or related field

Master's degree

PhD

Tools

Minitab

JMP

Job description

Medtronic is seeking a highly experienced Principal Process Engineer to develop and transfer scalable microelectronic packaging processes (PCB Assembly and Wafer Level) into manufacturing. You will optimize underfill, placement, solder paste, reflow, curing, and metrology, while interfacing with upstream/downstream teams to ensure robust, compliant processes.

The role requires advanced knowledge in SPC, DOE, and statistical methods, with a track record in high-volume manufacturing and strong