Lead Manufacturing Engineer, Advanced Components

BIOTRONIK SE & Co.KG; Lake Oswego (OR); On-site; USD 110,000 - 160,000; Full time

Job summary

Micro Systems Engineering, Inc. is seeking a Staff Manufacturing Engineer in Advanced Components to develop, implement, and qualify new supply chain and technology platforms for high-reliability electronics.

You will lead cross-functional teams to meet quality, reliability, volume, delivery and cost objectives. The role requires a strong background in electrical packaging, 8+ years of related experience, and proven leadership to drive projects in a highly automated environment.

Qualifications

• B.Sc. or M.Sc in Electrical Engineering, Applied Physics, Material Science, or equivalent physical science, with evidence of high academic achievement
• Excellent written and verbal communications skills; Detail oriented
• 8+ years experience with chip scale packaging, direct bump attach, copper pillar, and similar technologies
• Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach; their materials and processes.
• Detailed knowledge of IC packaging failure modes and root cause analysis techniques
• Experience in high reliability electronics manufacturing environment
• Experience with quality systems including technical writing of quality-relevant documentation
• Strong physics based reasoning
• Experience with failure analysis and root cause corrective action with suppliers
• Demonstrated ability to conceive, implement and complete engineering projects and experiments on schedule
• Proven leadership skills with ability to coach, mentor, and lead technical staff
• Proficiency in standard office productivity software (Excel, Word, PowerPoint, etc... )
• Demonstrated ability to interface across multiple functions/organizations (Quality, Manufacturing, Supply Chain, Test, Module/System development) to drive closure on projects.
• Demonstrated creativity with multiple examples of innovative solutions. U.S. or EU Patents desirable.

Responsibilities

• Define & deploy technology platforms in a cross-functional team for new product applications through testing, simulation and prototypes.
• Qualification of components for use in surface mount electronic manufacturing.
• Use systematic problem-solving approaches to resolve quality/performance issues with suppliers, development, and manufacturing teams.
• Lead testing and validation of components for high reliability applications, by performing use case based electrical and environmental stress tests.
• Implementation tasks including leading stage-gate approvals, documentation, supplier quality interface, characterization, verification and on-going sustaining support in a highly automated manufacturing environment.
• Support new development projects ensuring compliance to internal and industry standards
• Perform failure analysis and drive to root cause supporting production and prototyping
• Engage with internal and external customers on technical topics
• Assess, communicate with key stakeholders, and qualify process changes at suppliers
• Perform on-site supplier audits, domestic and international

Skills

Chip scale packaging

Direct bump attach

Copper pillar

High reliability electronics

Education

B.Sc. or M.Sc in Electrical Engineering or related field

Tools

Wafer-level packaging

Wire bonding

Encapsulation

Chip attach

Job description

Micro Systems Engineering, Inc. is seeking a Staff Manufacturing Engineer in Advanced Components to develop, implement, and qualify new supply chain and technology platforms for high-reliability electronics.

You will lead cross-functional teams to meet quality, reliability, volume, delivery and cost objectives. The role requires a strong background in electrical packaging, 8+ years of related experience, and proven leadership to drive projects in a highly automated environment.