Senior Process Engineer — Flip Chip & 3D Packaging (Hybrid)

Langham Recruitment; San Diego (CA); Hybrid; USD 160,000 - 190,000; Full time

Benefits offered by this job

Equity

Full benefits package

Hybrid work arrangement

Job summary

Langham Recruitment client in San Diego seeks a Senior Process Engineer to own development, optimization and scaling of manufacturing processes for advanced optoelectronic products. Hybrid work model with strong collaboration across engineering, suppliers and contract manufacturers.

The role focuses on Flip Chip packaging, Thermo-Compression Bonding, 2.5D/3D architectures, DOE experiments, and process reliability to drive yield, performance and scalable production.

Qualifications

• 5+ years in manufacturing or process engineering.
• Hands-on experience with Flip Chip packaging and Thermo-Compression Bonding.
• Experience with 2.5D/3D packaging technologies.
• Strong DOE, Gage R&R and statistical process analysis knowledge.
• Experience using JMP or Minitab.
• Knowledge of FMEA and process reliability.
• Background in semiconductors, microelectronics, photonics or optoelectronics.

Responsibilities

• Develop and optimise assembly and manufacturing processes for advanced optoelectronic products.
• Lead process development around Flip Chip packaging and Thermo-Compression Bonding.
• Support integration of 2.5D and 3D packaging architectures.
• Design and run DOE experiments to improve yield, performance and reliability.
• Monitor manufacturing process health, including yield and failure analysis.
• Work with suppliers, subcontractors and contract manufacturers to ensure scalable processes.
• Develop SOWs and project plans for new process development activities.

Skills

5+ years experience

Flip Chip packaging

Thermo-Compression Bonding

2.5D/3D packaging

DOE / Gage R&R / SQA

JMP / Minitab

FMEA / reliability

Semiconductors / optoelectronics

Tools

JMP

Minitab

Job description

Langham Recruitment client in San Diego seeks a Senior Process Engineer to own development, optimization and scaling of manufacturing processes for advanced optoelectronic products. Hybrid work model with strong collaboration across engineering, suppliers and contract manufacturers.

The role focuses on Flip Chip packaging, Thermo-Compression Bonding, 2.5D/3D architectures, DOE experiments, and process reliability to drive yield, performance and scalable production.