Hybridization Engineer - FPA & Flip-Chip Lead

well-funded deeptech startup; California (MO); Hybrid; USD 80,000 - 100,000; Full time

Job summary

A hybridization Mechanical Engineer is sought by a well-funded deeptech startup in California focused on semiconductor innovations. This hands-on role involves supporting manufacturing activities for infrared and visible focal plane array (FPA) assemblies, optimizing production processes, and leading technical teams.

Ideal candidates should have a Master’s degree and a strong understanding of flip-chip bonding, along with five years of relevant experience. You will contribute to manufacturing troubleshooting and lead efforts in process control and risk management.

Qualifications

• Knowledge of flip-chip bonding and assembly processes including epoxy bonding.
• Strong background in opto-electronic semiconductor devices.
• Effective communication of complex ideas to various audiences.

Responsibilities

• Provides technical leadership in FPA fabrication process.
• Prepares workflows and manufacturing readiness review charts.
• Oversees inspections, data analysis, and documentation.

Skills

Knowledge of flip-chip bonding

Experience in project management

Strong technical writing skills

Advanced computer proficiency

Education

Master’s Degree with five years of experience

Tools

Microsoft Office Suite (Word, Excel, PowerPoint)

Job description

A hybridization Mechanical Engineer is sought by a well-funded deeptech startup in California focused on semiconductor innovations. This hands-on role involves supporting manufacturing activities for infrared and visible focal plane array (FPA) assemblies, optimizing production processes, and leading technical teams.

Ideal candidates should have a Master’s degree and a strong understanding of flip-chip bonding, along with five years of relevant experience. You will contribute to manufacturing troubleshooting and lead efforts in process control and risk management.