Process Engineer - Semiconductor Packaging

Luminus Devices; Sunnyvale (CA); On-site; USD 130,000 - 175,000; Full time

Benefits offered by this job

401k with employer match

Paid time off

Flexible spending accounts

Employee assistance program

Life/AD&D insurance

Job summary

Luminus Devices in Sunnyvale, CA is seeking a Process Engineer with a strong background in semiconductor packaging to advance high power LED products. The role splits time between process engineering and leading New Product Introduction efforts, with emphasis on wire bonding, die attach, and dispensing.

You will collaborate with contract manufacturers in Asia, manage projects, and drive cost/performance improvements while traveling up to 20% as needed.

Qualifications

• Master or PhD degree in engineering, physics, materials or related fields.
• Minimum 5 years in manufacturing processing of semiconductor packages (wire bonding, die attach, dispensing).
• Experience with high power LED packages is preferred.
• Familiar with lead frame and ceramic package technologies with copper heat spreaders.
• Experience with hermetic sealing, over molding and transfer/injection molding processes.

Responsibilities

• Develop recipes for wire bonding, die attach and dispensing for a low-volume prototype line.
• Build control plans and monitor via destructive tests and SPC.
• Publish lot reports and pareto analyses of yield losses.
• Transfer recipes and control plans to high-volume partners in Asia.
• Collaborate with Asian contract manufacturers to co-develop LED packages from concept to mass production.

Skills

wire bonding

die attach

dispensing

project management

leadership

Education

Master's or PhD in engineering/physics/materials

Tools

D/PFMEA

Contract manufacturers (CMs)

Job description

Luminus is a vertically integrated fast-growing high-tech company that engages in high power Light-Emitting-Diode (LED) solid-state lighting for a variety of application areas such as industrial UV, IR, medicals, projection displays, high-end illumination lighting, horticulture lighting, and automotive lighting. Luminus is at the forefront of the undergoing solid-state lighting revolution that will change lighting technology in almost every aspect of our everyday work and life. Luminus, Inc. is an Equal Opportunity Employer. We foster a work environment that's inclusive as well as diverse and if you are looking for a place where you can grow, work hard, and have fun this is a GREAT opportunity to learn about the lighting technology world and be part of an exciting forward company!

We are looking for a Process Engineer with experience in Semiconductor Packaging, especially in high power applications. The successful candidate will spend approximately 50% performing Process Engineering and 50% of their time leading New Product Introduction (NPI) for high power LED products. This is an excellent opportunity for an experienced Process Engineer to diversify his career with Product Development - Project Management Experience.

Key Responsibilities

50%

• Develop recipes for wire bonding, die attach and dispensing processes for a low volume prototype assembly line.
• Build Control Plan for these processes and track via destructive test monitoring and SPC.
• Publish lot reports, including pareto of yield losses, CpK, etc.
• Transfer recipes, control plan, etc. to high volume manufacturing partners in the Asia region.
• Evaluate new materials for these processes to improve performance or reduce costs.

50%

• Develop high power LED packages for Medical, Life Sciences and Industrial applications. This requires innovative thinking on concepts, conducting optical performance testing and hands on experimentation to validate design.
• Collaborate with Asian Contract Manufacturers to co-develop LED packages from initial concepts through mass production to optimize performance and cost.
• Engage with the Supply Chain for critical Bill of Material items, e.g. prisms, interposers, etc.
• Manage projects and track progress. Update the larger Project team on a weekly basis.
• Generating intellectual property and working with patent attorneys to file patent applications.

Qualifications For The Position

• Master or PhD degree in engineering, physics, materials or related fields.
• Minimum 5 years of experience in manufacturing processing of semiconductor packages, including wire bonding, die attach (epoxy, eutectic, sintering) and dispensing. Experience with high power packages is preferred. Specific experience with LED Diode packages is highly desirable.
• Be familiar with the standard packaging technologies used in power devices, such as lead frame, ceramic (single & multi-layer) and ceramic packages with integrated copper heat spreaders.
• Have experience with hermetic sealing, over molding and transfer/injection molding processes.
• Practice with critical processes such as D/PFMEA for power semiconductor products.
• Experience working with CM's is desirable.
• Highly motivated individual and good team player. "Whatever it takes" attitude - Strong sense of project ownership with strong desire to push projects toward end goals.
• Be able to travel internationally on a need basis. (up to 20%)
• Paid Time Off & Holidays
• 401k Retirement Savings Plan w/ Employer Match
• Flexible Spending Accounts
• Employee Assistance Program
• Life/AD&D Insurance
• And more!

Compensation Range: $130,000 - $175,000 / year

Title and compensation will be commensurate with experience and qualification.