Senior Principal SI Engineer (DDR4/5) – Hybrid Work

Rambus.com

Johns Creek (GA)

Hybrid

USD 126,000 - 234,000

Full time

8 days ago

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Benefits offered by this job

Bonus
Equity
401(k) match
Employee stock purchase plan
Medical benefits
Dental benefits
Time-off program
Gym membership

Job summary

Rambus is hiring an experienced Sr. Principal Engineer (SPE) for Signal Integrity and package design in Johns Creek, GA. The role reports to the Senior Director of Engineering and is a full-time position within the Memory Interface Chips BU.

You will work in a hybrid environment, spending about three days on-site and two days remote. You will lead SI/PI studies, develop packaging specifications, and collaborate with design, validation, and customers to optimize SI performance for DDR4/DDR5

Qualifications

  • MS or PhD in Electrical Engineering with 10+ years of industry experience
  • Experience with DDR4/5 and SERDES interfaces
  • Solid SI/PI and package design background
  • Experience with lab measurements and correlating with simulations
  • Proficiency with EDA tools (ADS, HFSS, Q3D/PowerSI)

Responsibilities

  • Create SI/PI methodologies and work with Design and SI teams for SI/PI study and package design for the DDR product portfolio
  • Define specifications and system design requirements (packaging, PCB routings, decoupling, channel simulations)
  • Provide guidelines to design teams based on SI/PI study and silicon correlation
  • Collaborate with customers to determine optimum SI/PI solutions
  • Support debug and lab Bring-Up as needed

Skills

SI/PI
Package design
DDR4/DDR5 familiarity
High-speed memory / SERDES
Lab measurements
Customer collaboration

Education

MS/PhD in Electrical Engineering

Tools

Spice
ADS
HFSS
Q3D/PowerSI
RedHawk/Totem
Virtuoso

Job description

Rambus is hiring an experienced Sr. Principal Engineer (SPE) for Signal Integrity and package design in Johns Creek, GA. The role reports to the Senior Director of Engineering and is a full-time position within the Memory Interface Chips BU.

You will work in a hybrid environment, spending about three days on-site and two days remote. You will lead SI/PI studies, develop packaging specifications, and collaborate with design, validation, and customers to optimize SI performance for DDR4/DDR5

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