Senior Principal Manufacturing Engineer: Process Innovator

Northrop Grumman; Middle River (MD); On-site; USD 123,000 - 154,000; Full time

Benefits offered by this job

Health insurance

Life insurance

Disability insurance

Savings plan

Paid holidays

Job summary

Northrop Grumman is seeking a Senior Principal Manufacturing Process Engineer 4 in Linthicum, MD. The role focuses on developing and optimizing production processes for advanced microelectronics and electro-mechanical assemblies.

Responsibilities include tooling design, equipment readiness, process documentation, and yield improvement. Occasional travel up to 10% is expected; candidate must be able to obtain a Secret security clearance.

Qualifications

• Bachelor's degree in Engineering or STEM plus 8+ years’ relevant experience, or Master's with 6+ years.
• Must be able to obtain a Secret security clearance; U.S. citizenship is required.
• Experience in manufacturing/process engineering for complex assemblies.

Responsibilities

• Develop and maintain manufacturing processes for high-technology assemblies.
• Create tooling designs and procure equipment for production readiness.
• Monitor process yields and implement quality improvements.
• Assist with training and design producibility reviews.
• Support with DOE, SPC and six-sigma concepts for process development.

Skills

Process development

ROI justification

Project planning

Tooling design

Manufacturing equipment

Process parameter optimization

Documentation

Yield monitoring

Problem solving

Training personnel

DOE/ SPC knowledge

Geometric tolerancing

3D modeling (CAD)

Unigraphics/NX

Teamcenter Manufacturing

Education

Bachelor's degree in Engineering or STEM

Master's degree (preferred)

Tools

CAD software (3D Solid Modeling)

J-STD/MIL-STD familiarity

Unigraphics/NX

Teamcenter Manufacturing

Job description

Northrop Grumman is seeking a Senior Principal Manufacturing Process Engineer 4 in Linthicum, MD. The role focuses on developing and optimizing production processes for advanced microelectronics and electro-mechanical assemblies.

Responsibilities include tooling design, equipment readiness, process documentation, and yield improvement. Occasional travel up to 10% is expected; candidate must be able to obtain a Secret security clearance.