Senior Power Hardware Architect (Onsite)

Hewlett Packard Enterprise; Sunnyvale (CA); On-site; USD 181,000 - 367,000; Full time

Job summary

Hewlett Packard Enterprise, based in Sunnyvale, CA, seeks a Sr Principal Power Hardware Engineer to lead architecture and delivery of power hardware across multiple platforms. The role emphasizes onsite work, collaboration with global teams, and driving technology roadmaps for data center and networking products.

You will mentor engineers, oversee power projects from definition to release, and apply cutting‑edge techniques to improve reliability and manufacturability.

Qualifications

• 12+ years related Power Design Engineering experience
• BSEE degree minimum; MS EE a plus
• Experience with liquid‑cooled power systems and high‑voltage architectures
• Solid experience with schematic capture and simulation tools (including SPICE)
• Familiarity with multilayer PCB Layout tools and Cadence Sigrity PowerDC

Responsibilities

• Establishes and defines organization‑wide architecture and methodologies for power hardware design across platforms
• Reviews and evaluates designs for compliance with guidelines and standards
• Drives integration of recommendations into architecture and leads platform architecture process
• Leads and mentors team members in electrical hardware design and innovation
• Lead assigned Board Mount Power projects and Front‑End Power projects from definition through release

Skills

Power design engineering

Technical leadership

SPICE simulation

PCB layout

I2C/PMBus

Firmware experience

Education

BSEE

MS EE

Tools

Cadence Sigrity PowerDC

Job description

Hewlett Packard Enterprise, based in Sunnyvale, CA, seeks a Sr Principal Power Hardware Engineer to lead architecture and delivery of power hardware across multiple platforms. The role emphasizes onsite work, collaboration with global teams, and driving technology roadmaps for data center and networking products.

You will mentor engineers, oversee power projects from definition to release, and apply cutting‑edge techniques to improve reliability and manufacturability.