Senior Power Delivery Architect – Hyperscale AI

Persimmons, Inc.; San Jose (CA); On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

Competitive salary

Flexible PTO

401k

Job summary

Persimmons, Inc. is building the infrastructure to power the next decade of AI from its California base.

We seek a Senior Power Delivery Architect to design the rack-to-silicon power network for a multi-chiplet AI accelerator, delivering stable sub-1V silicon power while meeting stringent density and efficiency targets. You will own regulator strategy, decoupling hierarchy, and cross-functional co-design with silicon, packaging, and thermal teams, while applying AI-driven automation to optimize

Qualifications

• Bachelor’s or Master’s in Electrical Engineering; PhD a strong plus
• 8+ years in high-density PDN, rack-to-silicon power delivery
• Expertise with 48V busbar, VRM/CPVR/VPD, decoupling strategy
• Proficiency with PDN simulation tools (EMIR, electrothermal, EM co-sim)

Responsibilities

• Architect rack-to-silicon PDN for a multi-chiplet AI accelerator
• Own regulator integration strategy (VRMs, CPVR, VPD)
• Design multi-tier decoupling capacitor hierarchy and simulate impedance
• Model di/dt transients and IR drop across the 400-chiplet grid
• Collaborate with silicon, packaging, and thermal teams for co-design
• Leverage AI to optimize power delivery and automate repetitive tasks

Skills

Power delivery

Cross-domain collaboration

System design

Education

Bachelor’s/Master’s in Electrical Engineering

PhD in power delivery (strong plus)

Tools

EMIR

Electrothermal simulations

EM co-simulation

2.5D/3D packaging constraints

Job description

Persimmons, Inc. is building the infrastructure to power the next decade of AI from its California base.

We seek a Senior Power Delivery Architect to design the rack-to-silicon power network for a multi-chiplet AI accelerator, delivering stable sub-1V silicon power while meeting stringent density and efficiency targets. You will own regulator strategy, decoupling hierarchy, and cross-functional co-design with silicon, packaging, and thermal teams, while applying AI-driven automation to optimize