Lead R&D Architect - Package Substrate & EDA Tools

Synopsys; Austin (TX); On-site; USD 180,000 - 250,000; Full time

Job summary

Synopsys in Austin, TX is seeking an Architect R&D Engineer to lead cutting-edge work in package substrate design automation and to guide a team of engineers in solving challenging problems at the intersection of silicon and packaging.

You will engage with foundries, OSATs, and internal R&D groups to translate complex requirements into scalable tooling, while also mentoring junior engineers and shaping the technical roadmap for next‑gen substrate technologies.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or Computer Science.
• 10+ years of experience in EDA software development with focus on physical design automation, package design, or substrate design.
• Deep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysis.
• Strong programming proficiency in Python or TCL for tool integration and automation.
• Experience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++.
• Solid foundation in computational geometry and algorithm design for layout automation, experience with constraint-based routing or placement is highly valued.

Responsibilities

• Lead R&D projects advancing state-of-the-art in package substrate design automation, including auto-routing, DRC verification engines, PDN analysis, and design-for-manufacturing capabilities.
• Drive technical direction for database models enabling schematic-driven layout workflows and integration across the Synopsys packaging tool suite.
• Develop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automation.
• Collaborate with foundries and assembly/test companies to implement emerging substrate technologies, translating Design Rule Manuals into functional tooling.
• Define collateral input/output formats, integrate analysis capabilities, and ensure database architectures support complex designs.
• Provide technical guidance to engineers across the R&D organization, reviewing designs and implementations.

Skills

Python

C++

TCL

Computational geometry

Constraint-based routing

EDA tools

Education

Electrical/Computer Engineering or Computer Science

Tools

ODB++

CAD/EDA tooling

Job description

Synopsys in Austin, TX is seeking an Architect R&D Engineer to lead cutting-edge work in package substrate design automation and to guide a team of engineers in solving challenging problems at the intersection of silicon and packaging.

You will engage with foundries, OSATs, and internal R&D groups to translate complex requirements into scalable tooling, while also mentoring junior engineers and shaping the technical roadmap for next‑gen substrate technologies.