Senior Overlay Engineer, Advanced DRAM Bonding & Metrology

Micron; Boise (ID); On-site; USD 140,000 - 210,000; Full time

Job summary

Micron Technology in Boise, ID is seeking a Senior Overlay Architect to lead the overlay strategy, roadmap, and technical leadership for bonding overlay technologies. You will define specifications, sign-off criteria, and scaling needs for future nodes, and drive overlay metrology, automation, process control, and analytics.

Collaboration across Process Integration, Lithography, Bonding, Metrology, and Manufacturing will be essential as you translate findings into actionable improvements, mentor

Responsibilities

• Overlay strategy, roadmap & technical leadership for bonding overlay technologies.
• Lead simulation and experimental process development, maintaining overlay error budgets, validation plans, experiments, and assessments.
• Provide technical leadership across Process Integration, Lithography, Bonding, Metrology, Automation, Process Development, Equipment Development, and Manufacturing, and mentor engineers.

Job description

Micron Technology in Boise, ID is seeking a Senior Overlay Architect to lead the overlay strategy, roadmap, and technical leadership for bonding overlay technologies. You will define specifications, sign-off criteria, and scaling needs for future nodes, and drive overlay metrology, automation, process control, and analytics.

Collaboration across Process Integration, Lithography, Bonding, Metrology, and Manufacturing will be essential as you translate findings into actionable improvements, mentor