Senior Overlay Architect for Advanced DRAM & Bonding

Micron Technology; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Medical, Dental, Vision

Paid time off

Paid holidays

Retirement benefits

Job summary

Micron Technology is seeking a senior technical leader to own the overlay strategy, roadmap, and technical direction for advanced bonding and overlay technologies. You will define specifications, error budgets, and scaling requirements while guiding analytics, AI-driven insights, and experimental validation to accelerate learning and yield improvements.

You will lead cross-functional teams across Process Integration, Lithography, Bonding, Metrology, and Automation, mentor engineers, and

Qualifications

• Experience leading cross-functional teams in semiconductor development.
• Strong background in overlay technical strategies and standards.
• Proficient in analytics, modeling, and AI methods for process improvement.

Responsibilities

• Own the overlay roadmap and specifications for future technology nodes.
• Lead simulation and experimental activities linking process behavior to device requirements.
• Provide technical leadership across Process Integration, Lithography, Bonding, Metrology, and Manufacturing.

Skills

Overlay technology

Technical leadership

Analytics & AI

Semiconductor process

Job description

Micron Technology is seeking a senior technical leader to own the overlay strategy, roadmap, and technical direction for advanced bonding and overlay technologies. You will define specifications, error budgets, and scaling requirements while guiding analytics, AI-driven insights, and experimental validation to accelerate learning and yield improvements.

You will lead cross-functional teams across Process Integration, Lithography, Bonding, Metrology, and Automation, mentor engineers, and