Senior Optical Engine Architect for AI Interconnects

IC Resources; California (MO); On-site; USD 180,000 - 280,000; Full time

Job summary

IC Resources is partnering with a leading photonics company to develop next-generation optical engines for AI infrastructure. The role focuses on architecture, integration across silicon photonics, and high-speed interconnects, with cross-functional leadership spanning product requirements to silicon validation.

The ideal candidate has extensive experience in optical link architecture, PIC/EIC co-design, and advanced packaging, with a track record of delivering high-speed transceivers and

Qualifications

• Experience architecting high-speed optical links or optical engines.
• Deep knowledge of silicon photonics and PIC/EIC co-design.
• Experience with active modulators, photodetectors, and high-speed drivers.

Responsibilities

• Own architecture and technical definition of high-speed optical engines.
• Translate market requirements into product and engineering specs.
• Define end-to-end optical budgets and model dispersion, noise and FEC trade-offs.
• Lead tape-out readiness and 2.5D integration strategies.
• Provide technical leadership across EIC development and SerDes interfaces.
• Coordinate across PICs, drivers, and packaging teams.
• Oversee system bring-up, validation, and post-silicon characterization.

Skills

Optical link architecture

Silicon photonics

TIAs and drivers

Modulators and detectors

System integration

Cross-functional leadership

2.5D integration

Tools

Ansys Lumerical

OptoCompiler

IPKISS

Cadence EPDA

OptoSPICE

Virtuoso

Spectre

Innovus

Job description

IC Resources is partnering with a leading photonics company to develop next-generation optical engines for AI infrastructure. The role focuses on architecture, integration across silicon photonics, and high-speed interconnects, with cross-functional leadership spanning product requirements to silicon validation.

The ideal candidate has extensive experience in optical link architecture, PIC/EIC co-design, and advanced packaging, with a track record of delivering high-speed transceivers and