Principal Optical Engine Architect: Lead High-Speed Links

Xscape Photonics Inc; Santa Clara (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Xscape Photonics Inc in Santa Clara, CA, seeks a Principal Optical Engine Architect to lead the optical link design for next-generation products, defining OCI-MSA ready Optical Engine architectures and translating MRDs into actionable PRDs.

You will integrate PIC and EIC, drive high-speed modulation choices, signal integrity, and system-level budgeting, collaborating across hardware, software, and product management to deliver robust, scalable interconnect solutions.

Qualifications

• 10+ years as a Transceiver/Link/Systems Architect.
• Experience at tier-1 semiconductor or optical networking companies is preferred.
• Deep PIC and EIC architectural knowledge.
• Proven track record in optical transceiver design (OSFP, QSFP-DD, Co-Packaged Optics).
• Mastery of link budgeting and optical penalties; FEC trade-offs.
• Familiarity with OCI/MSA standards and ecosystems.
• Ability to translate MRDs into highly detailed PRDs and specs.

Responsibilities

• PRD generation and ownership in collaboration with Product Management.
• Architect complete transceiver sub-systems meeting power, performance, and cost targets.
• Define end-to-end optical link budget and model impairments.
• Lead PIC & EIC integration bridging DSPs, TIAs, Modulator Drivers, and optics.
• Make modulation and signal integrity decisions for high-speed links.
• Ensure OCI/MSA standards alignment and industry representation.
• Conduct rigorous trade-off analyses for architectures, packaging, and components.

Skills

Transceiver Architect

Link Architect

PRD writing

PIC & EIC integration

Signal integrity

Education

MS/PhD in Electrical Engineering / Photonics / Physics

Job description

Xscape Photonics Inc in Santa Clara, CA, seeks a Principal Optical Engine Architect to lead the optical link design for next-generation products, defining OCI-MSA ready Optical Engine architectures and translating MRDs into actionable PRDs.

You will integrate PIC and EIC, drive high-speed modulation choices, signal integrity, and system-level budgeting, collaborating across hardware, software, and product management to deliver robust, scalable interconnect solutions.