Senior Microelectronics Packaging Process Engineer

Medtronic; Tempe (AZ); On-site; USD 84,000 - 126,000; Full time

Job summary

Medtronic is seeking a Process Engineer II to develop and transfer robust microelectronic packaging processes (PCB assembly and wafer-level packaging) into high-volume manufacturing. You will monitor outputs, run experiments, and define tooling, controls, and design rules to enable scalable production.

The role requires a Bachelor’s with 2+ years of related experience or a Master’s with 0+ years, with strong knowledge of SPC, DOE, and process validation, in a facility emphasizing high-volume

Qualifications

• Bachelor's degree with 2+ years of relevant experience
• Master's degree with 0+ years of relevant experience
• Experience in microelectronics packaging desired

Responsibilities

• Develops and transfers PCB assembly and packaging processes to manufacturing.
• Performs IQ/OQ/PQ and gage R&R studies.
• Applies SPC and DOE to design experiments and improve yield and robustness.
• Documents processes per quality system regulations and ensures regulatory compliance.
• Troubleshoots equipment/process production issues and provides sustaining engineering support.

Skills

Statistical methods

DOE (Design of Experiments)

Process improvement

Root cause analysis

Education

Bachelor's degree in Engineering or related field

Master's degree in Engineering (optional)

Tools

Minitab

JMP

Gage R&R

Metrology tools

Job description

Medtronic is seeking a Process Engineer II to develop and transfer robust microelectronic packaging processes (PCB assembly and wafer-level packaging) into high-volume manufacturing. You will monitor outputs, run experiments, and define tooling, controls, and design rules to enable scalable production.

The role requires a Bachelor’s with 2+ years of related experience or a Master’s with 0+ years, with strong knowledge of SPC, DOE, and process validation, in a facility emphasizing high-volume