Senior Microelectronics Packaging Process Engineer

Teledyne Technologies Incorporated; United States; On-site; USD 91,000 - 121,000; Full time

Job summary

Teledyne Technologies Incorporated is seeking a Senior Process Engineer in Milpitas, CA, to design and scale high-reliability microelectronic packaging and assembly processes. You will work closely with manufacturing teams, suppliers, and customers to ensure robust production qualification and program readiness.

The ideal candidate has 8+ years in microelectronic assembly, expertise in die attach, wire bonding, flip chip, underfill, encapsulation, and strong communication skills.

Qualifications

• Process development, scale-up, and manufacturing problem-solving skills.
• Die attach, wire bonding, flip chip, underfill, encapsulation, hermetic sealing, and packaging experience.
• Knowledge of electronic materials, equipment qualification, statistical analysis, and process control.
• Strong written and verbal communication skills.
• Bachelor's or Master's degree in Engineering, Materials Science, or a related field.
• 8+ years of experience developing microelectronic assembly processes.

Responsibilities

• Develop, implement, scale, and maintain microelectronic packaging and assembly processes.
• Establish process controls and evaluate new materials and automated equipment.
• Support material review board activities and resolve nonconforming product issues.
• Partner with suppliers and customers to address material and production concerns.
• Contribute to design reviews, program readiness, design for manufacturability, and new product development.
• Design and document precision tooling, fixtures, bills of materials, and assembly drawings.
• Program, troubleshoot, and qualify manufacturing equipment.
• Create clear process documentation and step-by-step production instructions.
• Apply statistical analysis, process control, problem-solving, and design of experiments.
• Communicate complex technical topics effectively across technical and operational audiences.

Skills

Process development

Scale-up

Manufacturing problem-solving

Die attach

Wire bonding

Flip chip

Underfill

Encapsulation

Hermetic sealing

Statistical analysis

Design for manufacturability

Equipment programming

Education

Bachelor's degree in Engineering

Master's degree in Engineering

Tools

Equipment programming

Job description

Teledyne Technologies Incorporated is seeking a Senior Process Engineer in Milpitas, CA, to design and scale high-reliability microelectronic packaging and assembly processes. You will work closely with manufacturing teams, suppliers, and customers to ensure robust production qualification and program readiness.

The ideal candidate has 8+ years in microelectronic assembly, expertise in die attach, wire bonding, flip chip, underfill, encapsulation, and strong communication skills.