Senior Space Microelectronics Packaging Engineer (Level 3/4)

Northrop Grumman; Linthicum (MD); On-site; USD 108,800 - 163,200; Full time

Benefits offered by this job

Health insurance

Paid time off

Retirement savings plan

Job summary

Northrop Grumman in Linthicum, MD is seeking an experienced Electro-Mechanical Engineer (level 3/4) to lead mechanical design and testing for satellite programs. This role requires a candidate with a strong STEM background and extensive experience in mechanical design, particularly micro-circuit technology.

The ideal candidate will work with diverse teams to develop innovative solutions, and will be involved in all phases of design, from concept to integration and testing. Relocation assistance may be available.

Qualifications

• 5+ years of engineering experience for Level 3; 8+ years for Level 4.
• Experience with mechanical design tools.
• Ability to present complex concepts.

Responsibilities

• Lead mechanical design and testing for RF and EO aperture.
• Develop micro-circuit hardware and systems.
• Facilitate knowledge sharing and mentoring.

Skills

Mechanical design and analysis

Micro-circuit technology

CAD modeling

Team collaboration

Troubleshooting

Education

B.S degree in STEM

Master’s degree in STEM

Ph.D. in STEM

Tools

AutoCAD

3D CAD software

Job description

Northrop Grumman in Linthicum, MD is seeking an experienced Electro-Mechanical Engineer (level 3/4) to lead mechanical design and testing for satellite programs. This role requires a candidate with a strong STEM background and extensive experience in mechanical design, particularly micro-circuit technology.

The ideal candidate will work with diverse teams to develop innovative solutions, and will be involved in all phases of design, from concept to integration and testing. Relocation assistance may be available.