Senior Microelectronics Packaging Engineer (Space Systems)

Northrop Grumman Corp. (JP); Linthicum (MD); On-site; USD 108,800 - 163,200; Full time

Benefits offered by this job

Health insurance

Paid time off

Discretionary bonuses

Job summary

Northrop Grumman Corp. (JP) is seeking an experienced Electro-Mechanical Engineer to lead mechanical design and testing for satellite programs. The ideal candidate will have a strong background in micro-circuit development and be skilled in collaboratively driving innovative engineering solutions.

This full-time position is based in Linthicum, MD, and requires a B.S. in a STEM field with significant engineering experience. Northrop Grumman offers competitive salary ranges, including potential bonuses and comprehensive benefits.

Qualifications

• 5 years of engineering experience for Principal level or 8 years for Sr. Principal.
• Experience presenting complex technical concepts to varied audiences.
• Ability to read schematics and manufacturer specifications.

Responsibilities

• Lead mechanical design and testing for RF and EO aperture.
• Responsible for advanced micro-circuit design.
• Ensure cost, schedule, and technical performance of satellite programs.

Skills

Mechanical design

Micro-circuit technology

AutoCAD

3D CAD software

Education

B.S degree in a STEM field

Tools

CAD modeling tools

Job description

Northrop Grumman Corp. (JP) is seeking an experienced Electro-Mechanical Engineer to lead mechanical design and testing for satellite programs. The ideal candidate will have a strong background in micro-circuit development and be skilled in collaboratively driving innovative engineering solutions.

This full-time position is based in Linthicum, MD, and requires a B.S. in a STEM field with significant engineering experience. Northrop Grumman offers competitive salary ranges, including potential bonuses and comprehensive benefits.