Senior Mechanical Engineer - Microelectronics Packaging (Hybrid)

D.O.M. magazine; Northern (KY); Hybrid; USD 86,000 - 147,000; Full time

Benefits offered by this job

Health insurance

401(k) savings plan

Disability coverage

Life and accident insurance

Paid time off

Paid holidays

Parental leave

Military leave

Bereavement leave

Discounts on home/auto/pet insurance

Job summary

BAE Systems is seeking an experienced Mechanical Engineer for Microelectronics Packaging in Cedar Rapids, IA. The role blends onsite and remote work, supporting design, development, and manufacturing of next-generation GPS-related packages.

Responsibilities span from concept to factory support; requires a Bachelor’s in Engineering and 4+ years in microelectronics packaging, with a DoD clearance in scope.

Qualifications

• Bachelor's degree in Engineering with focus on Mechanical, Aerospace or Material Engineering.
• 4+ years of direct microelectronics packaging experience or equivalent.
• Ability to obtain DoD security clearance.

Responsibilities

• Contribute to program pursuits and bid estimates.
• Participate in microelectronics product development: packaging concept and board design.
• Develop technologies for next-generation packages.
• Coordinate prototype builds and evaluation.
• Conduct failure analysis for microelectronics packages.
• Support factory transition and provide manufacturing support.

Skills

4+ years microelectronics packaging

Bachelor's degree in Mechanical/Aerosb

Education

Bachelor's degree in Engineering (Mechanical, Aerospace or Material)

Tools

Microelectronics packaging development

Job description

Company:

BAE Systems

Category:

Maintenance

Job Type:

Permanent

City:

Cedar Rapids

State:

Country:

United States

Job Description Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely. You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The WorldTM.” Sound like a team you want to be a part of? Come build your career with BAE Systems In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions. BAE Systems is looking for an experienced Mechanical Engineer with a passion for engineering and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that support the war fighter. The position offers abundant opportunity to design and develop state of the art miniaturized electronic devices. As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification, and factory support. The successful applicant should be knowledgeable in microelectronics packaging concepts and technologies.Primary Responsibilities:

• Contribute to program pursuits and bid estimates
• Participate in Microelectronics product development activities including packaging concept, preliminary/detailed board design and packaging road mapping efforts
• Develop technologies required for next generation packages
• Coordinate prototype package builds and evaluation efforts
• Conduct failure analysis for microelectronics packages
• Support factory transition of products
• Provide manufacturing support for Microelectronics assemblies currently in production

Requirements:

Required Education, Experience, & Skills

• All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)
• Bachelor's degree in Engineering with focus on Mechanical, Aerospace or Material Engineering and 4+ years of direct microelectronics packaging related experience or equivalent

Preferred Education, Experience, & Skills

• Microelectronics design and manufacturing assembly
• Microelectronics packaging materials and materials properties
• Electronic component reliability testing
• Post wafer fabrication processes
• Additive manufacturing
• Wafer fabrication processes
• Advanced thermal packaging design

Pay InformationFull-Time Salary Range: $86460 - $146982Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20+ hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.

D.O.M. magazine is the premier magazine for aviation maintenance management professionals. Its management-focused editorial provides information maintenance managers need and want including business best practices, professional development, regulatory, quality management, legal issues and more. The digital version of D.O.M. magazine is available for free on all devices (iOS, Android, and Amazon Kindle).