Senior MEMS & HSIP Packaging Process Engineer

Draper Labs; Saint Petersburg (FL); On-site; USD 82,000 - 220,000; Full time

Benefits offered by this job

Work-life balance

Employee clubs

Workshops

Off-site social events

Museum discounts

Job summary

Draper is seeking a Senior Advanced Packaging/MEMS Process Engineer to apply advanced semiconductor and MEMS process knowledge to HSIP and Fan-Out Wafer-Level (FOWL) technologies.

You will collaborate with cross-functional teams to develop, optimize, and qualify processes, lead copper electroplating and etch steps, mentor engineers, and drive high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration. This role requires a US security clearance and is based in St. Petersburg, FL.

Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Physics.
• 5–10 years of Microsystems Engineering or related experience.
• U.S. Security Clearance required.
• Strong communication and teamwork skills.

Responsibilities

• Support copper electroplating process development to achieve HMLV yield and reliability targets.
• Define copper etch process optimization for fine-line patterning and DBI pre-bond surface preparation.
• Optimize and maintain MEMS-related processes and tools (wet/dry etch, vacuum/sputter, metrology).
• Collaborate with cross-functional teams to develop new processes and drive manufacturing readiness.
• Mentor less experienced engineers and share knowledge for new product development.

Skills

Communication

Analytical thinking

Time management

Team mentorship

Data-driven decisions

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical/Mechanical/Physics

Tools

MEMS fabrication tools

Metrology tools

Modeling software

Simulation software

Job description

Draper is seeking a Senior Advanced Packaging/MEMS Process Engineer to apply advanced semiconductor and MEMS process knowledge to HSIP and Fan-Out Wafer-Level (FOWL) technologies.

You will collaborate with cross-functional teams to develop, optimize, and qualify processes, lead copper electroplating and etch steps, mentor engineers, and drive high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration. This role requires a US security clearance and is based in St. Petersburg, FL.