Senior MEMS Packaging & 2.5D/3D Process Engineer

Inuplands; Saint Petersburg (FL); On-site; USD 82,000 - 220,000; Full time

Benefits offered by this job

Workplace flexibility

Employee clubs

Health/finance workshops

Discounts to local museums

Job summary

Draper in St. Petersburg, FL is seeking a Senior Advanced Packaging/MEMS Process Engineer to develop and qualify MEMS and HSIP/FOWL processes. The role supports end-to-end copper electroplating, copper etch optimization, and cross-functional collaboration for new business and product development.

You will guide tool-enabled process improvements, mentor engineers, and interact with cross-functional teams to ensure high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration.

Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Physics required.
• Master's degree preferred.
• 5-10 years of Microsystems Engineering or related experience.

Responsibilities

• Designs and develops MEMS devices/sensors and their layouts.
• Assesses performance and process capabilities using modeling or simulation software.
• Tests and evaluates devices with various tools and protocols.
• Addresses reliability, yield improvement, and failure issues.
• Develops production methods and fabrication processes for MEMS.
• Documents operating instructions and performance specs.
• Mentors less experienced engineers and shares knowledge.

Skills

Communication

Organization

Time management

Analytical skills

MEMS fabrication

Modeling software

Statistical process control

Education

Bachelor's degree in Electrical/Mechanical Engineering or Physics

Master's degree preferred

Tools

Wet & dry etch tools

Vacuum/Sputter systems

Metrology tools

Device design software

Statistical analysis tools

Job description

Draper in St. Petersburg, FL is seeking a Senior Advanced Packaging/MEMS Process Engineer to develop and qualify MEMS and HSIP/FOWL processes. The role supports end-to-end copper electroplating, copper etch optimization, and cross-functional collaboration for new business and product development.

You will guide tool-enabled process improvements, mentor engineers, and interact with cross-functional teams to ensure high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration.