Senior MEMS & HSIP Packaging Process Engineer

Draper Labs; Saint Petersburg (FL); On-site; USD 120,000 - 170,000; Full time

Job summary

Draper Labs in St. Petersburg, FL is seeking a Senior Advanced Packaging/MEMS Process Engineer to apply advanced semiconductor and MEMS process knowledge to HSIP and Fan-Out Wafer-Level (FOWL) technologies.

You will lead copper electroplating and etch steps, collaborate with cross-functional teams, and mentor engineers to mature high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration. The role requires a US security clearance and is based in Saint Petersburg, FL, offering

Qualifications

• Experience with HSIP and Fan-Out Wafer-Level (FOWL) technologies.
• Ability to lead copper electroplating and etch steps.
• Mentor engineers and drive readiness for high-mix/low-volume manufacturing.
• Role based in St. Petersburg, FL with US security clearance.

Responsibilities

• Apply advanced semiconductor and MEMS process knowledge to HSIP and FOWL.
• Collaborate with cross-functional teams to develop, optimize, and qualify processes.
• Lead copper electroplating and etch steps and mentor engineers.
• Drive readiness for 2.5D/3D chiplet integration in a high-mix/low-volume environment.

Skills

Cross-functional collaboration

Mentoring engineers

Process optimization

2.5D/3D chiplet integration

Security clearance

Tools

Copper electroplating

Etch processes

HSIP

Fan-Out Wafer-Level (FOWL)

MEMS process knowledge

Job description

Draper is seeking a Senior Advanced Packaging/MEMS Process Engineer to apply advanced semiconductor and MEMS process knowledge to HSIP and Fan-Out Wafer-Level (FOWL) technologies.

You will collaborate with cross-functional teams to develop, optimize, and qualify processes, lead copper electroplating and etch steps, mentor engineers, and drive high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration. This role requires a US security clearance and is based in St. Petersburg, FL.