Senior Mechanical & Thermal Architect – AI Hardware

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Holidays

Job summary

Micron Technology is seeking a highly experienced Mechanical & Thermal Engineer to lead the mechanical and thermal architecture of groundbreaking hardware platforms. You will influence product strategy and collaborate across global teams to enable world-class computing solutions.

Ideal candidates bring deep expertise in thermal, mechanical, and heat mitigation for memory products, with a proven track record from concept to high-volume manufacturing.

Qualifications

• Bachelor’s or Master’s in Mechanical Engineering with 7+ years of relevant experience.
• Proven experience delivering mechanical/thermal solutions from concept to high-volume manufacturing.
• Strong proficiency with SolidWorks, CFD/thermal modeling, and relevant testing methodologies.

Responsibilities

• Design, develop, test, and release mechanical and thermal solutions for electronic systems.
• Develop cooling solutions: heat spreaders, heatsinks, vapor chambers, heat pipes, liquid cooling.
• Define and verify requirements for performance, quality, manufacturability.
• Lead thermal CFD and mechanical FEA analyses.
• Drive design reviews, risk assessments, and corrective actions.
• Collaborate with cross-functional teams and mentor engineers.

Skills

Thermal engineering

Mechanical design

Heat mitigation

Analytical problem solving

SolidWorks

Thermal CFD/FEA tools

AI-enabled workflows

GD&T

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

SolidWorks

CFD software (ANSYS Icepak/Fluent)

Heat transfer modeling tools

Job description

Micron Technology is seeking a highly experienced Mechanical & Thermal Engineer to lead the mechanical and thermal architecture of groundbreaking hardware platforms. You will influence product strategy and collaborate across global teams to enable world-class computing solutions.

Ideal candidates bring deep expertise in thermal, mechanical, and heat mitigation for memory products, with a proven track record from concept to high-volume manufacturing.