Senior Mechanical Engineer - AI Hardware Thermal Lead

Amazon; Austin (TX); On-site; USD 159,000 - 215,000; Full time

Job summary

Annapurna Labs, the AWS organization, seeks a Sr. Mechanical Engineer to own thermal and mechanical architecture for ML/AI accelerator platforms from concept to fleet deployment.

You will collaborate with silicon, firmware, manufacturing, and supply chain teams to deliver high power-density systems at global scale. You will lead design reviews, drive standardization, and mentor engineers while shaping validation methodologies for next-generation Trainium and Inferentia hardware.

Qualifications

• BS degree in mechanical engineering or equivalent.
• 7+ years industry experience in Mechanical and Thermal design in electronics packaging.
• Experience in thermal and performance measurements and characterization on SoCs, Servers, or related Systems.
• 3+ years of experience in SoC Thermal modelling and IC package transient thermal response.
• Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems.
• Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined component design for electronics packaging.
• Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies.
• Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams.

Responsibilities

• Own the complete thermal and mechanical design for ML/AI accelerator platforms — from rack-level infrastructure down to chip packaging.
• Define thermal and mechanical design requirements, establish design targets, and drive cross-functional alignment across hardware, firmware, and software teams.
• Deliver production platforms through the full lifecycle: concept, design, analysis, prototyping, validation, manufacturing ramp, and fleet operations.
• Design and optimize cooling solutions (air and liquid) for high-power-density ML/AI accelerators.
• Develop detailed CFD models, compact RC models, and structural FEA for SoC/package thermal analysis and mechanical integrity.
• Design rack manifolds, cold plates, and data center liquid cooling interfaces for at-scale liquid-cooled deployments.
• Develop and validate mechanical structures including chassis and enclosures for manufacturability, reliability, and serviceability.
• Own mechanical design of high-speed interconnect subsystems — specifying alignment, gatherability, insertion force, and serviceability requirements.
• Perform structural FEA for shock, vibration, and transportation loads to ensure mechanical integrity.

Education

BS degree in mechanical engineering or equivalent

Tools

Ansys Icepak

FloTherm

Cadence Celsius

PTC Creo

Solidworks

Job description

Annapurna Labs, the AWS organization, seeks a Sr. Mechanical Engineer to own thermal and mechanical architecture for ML/AI accelerator platforms from concept to fleet deployment.

You will collaborate with silicon, firmware, manufacturing, and supply chain teams to deliver high power-density systems at global scale. You will lead design reviews, drive standardization, and mentor engineers while shaping validation methodologies for next-generation Trainium and Inferentia hardware.