Senior Mechanical & Thermal Design Engineer for AI Memory

Micron Technology, Inc; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Job summary

Micron Technology, Inc. seeks a Mechanical/ Thermal Principal Design Engineer to lead mechanical and thermal architecture for next‑gen memory hardware.

You will influence product strategy, drive critical engineering decisions, and collaborate across global teams to enable world‑class computing solutions. The ideal candidate brings deep expertise in thermal management, mechanical design, and heat mitigation, with a proven record delivering products from concept to high‑volume manufacturing.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering with 7+ years of mechanical/thermal experience.
• Proven track record delivering mechanical/thermal solutions for product development.
• Strong expertise in SolidWorks, thermal modeling, and CFD tools.

Responsibilities

• Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems and memory technologies.
• Develop cooling solutions including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling.
• Define requirements to meet product performance, quality, and customer objectives.
• Lead thermal CFD and mechanical FEA analyses to optimize performance and reliability.
• Develop validation strategies including thermal characterization, shock/vibration tests, and reliability assessments.
• Drive design reviews, risk assessments, and corrective actions across the product lifecycle.
• Collaborate with cross-functional teams to deliver manufacturable solutions; contribute to JEDEC standards.
• Mentor engineers and champion AI-enabled design workflows to enhance simulation and productivity.

Skills

SolidWorks

Thermal modeling

CFD analysis

AI-enabled design workflows

Design optimization

GD&T

FMEA

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

ANSYS Icepak

Fluent

Finite element analysis (FEA)

Job description

Micron Technology, Inc. seeks a Mechanical/ Thermal Principal Design Engineer to lead mechanical and thermal architecture for next‑gen memory hardware.

You will influence product strategy, drive critical engineering decisions, and collaborate across global teams to enable world‑class computing solutions. The ideal candidate brings deep expertise in thermal management, mechanical design, and heat mitigation, with a proven record delivering products from concept to high‑volume manufacturing.