Senior Mechanical Engineer, RF Payloads for Space

Blue Origin LLC; Seattle (WA); On-site; USD 121,000 - 169,000; Full time

Benefits offered by this job

Medical insurance

Paid time off

401(k) with company match

Job summary

Blue Origin is seeking a Mechanical Engineer III to lead the mechanical design and packaging of RF payload hardware for the TeraWave network. You will guide architecture studies, coordinate with RF/electrical teams, and ensure producible mechanical solutions for high‑power environments.

You will mentor engineers, apply GD&T, and perform structural/thermal analyses to validate designs across programs, with a focus on reliability and manufacturability in space hardware contexts.

Qualifications

• Bachelor's degree in Mechanical Engineering or related field.
• 6+ years of mechanical design and packaging of complex electronic hardware systems.
• Proficiency with 3D CAD tools (CATIA, SolidWorks, NX) for assembly modeling.
• Experience performing structural and thermal analyses using analytical methods or FEM tools.
• Knowledge of GD&T principles and ASME Y14.5 in mechanical designs.

Responsibilities

• Lead design and packaging of mechanical structures for phased array antennas and RF payload hardware assemblies.
• Direct thermal management strategies for high‑power RF payload electronics to meet performance and reliability targets.
• Perform structural and thermal analyses and tolerance stack‑ups to validate RF payload mechanical designs.
• Lead architecture trade studies to define mechanical packaging approaches across programs.
• Serve as technical point of contact for RF payload mechanical design, coordinating with electrical/RF teams.
• Mentor junior engineers on RF payload packaging and analysis practices.

Skills

6+ years mechanical design

3D CAD (CATIA, SolidWorks, NX)

Structural and thermal analysis

GD&T (ASME Y14.5)

RF payload packaging

Education

Bachelor's degree in Mechanical Engineering

Tools

CATIA

SolidWorks

NX

Job description

Blue Origin is seeking a Mechanical Engineer III to lead the mechanical design and packaging of RF payload hardware for the TeraWave network. You will guide architecture studies, coordinate with RF/electrical teams, and ensure producible mechanical solutions for high‑power environments.

You will mentor engineers, apply GD&T, and perform structural/thermal analyses to validate designs across programs, with a focus on reliability and manufacturability in space hardware contexts.