Senior Lead, High-Speed Electrical/Optical Post-Silicon

Socket.dev; San Diego (CA); On-site; USD 192,000 - 288,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks a Senior Lead High-speed Electrical/Optical Post-Silicon Engineer in San Diego to drive hands-on measurements and debug of 224G/448G interconnects across package, PCB, and system channels.

You will lead serdes/DDR validation, PDN debug, and cross-functional efforts with PHY, package, optics, firmware, and software teams, delivering automated validation content and robust design feedback.

Qualifications

• 8+ years in post-silicon, SI/PI, SerDes/DDR, optical, or system validation.
• Strong fundamentals in high-speed design, SerDes/DDR PHYs, SI/PI, and modeling.
• Hands-on with VNAs, oscilloscopes, BERTs, TDR/TDT, spectrum analyzers, and probing.
• Experience validating high-speed links (DDR, PCIe/CXL, Ethernet, UCIe).
• PDN/system debug including rail noise, coupling, sequencing, and power stress.

Responsibilities

• Plan and drive 224G/448G measurements and channel characterization across package, PCB, connector, and system channels.
• Lead post-silicon bring-up, margining, shmoo, and SW/HLOS validation across reference boards and platforms.
• Drive PDN measurement and failure isolation across lab signatures and platform iterations.
• Develop automation, data reduction scripts, dashboards, and regression flows.
• Collaborate with SerDes PHY, package, PCB, optics, firmware, software, and validation teams to close issues.

Skills

High-speed design

SerDes/DDR PHYs

SI/PI fundamentals

Measurement correlation

Post-silicon validation

Cross-functional leadership

Education

Bachelor's degree in Engineering/CS/IS

Master's degree in Engineering/CS/IS

PhD in Engineering/CS/IS

C/C++/Java/Python programming

Debugging techniques

Tools

VNAs

Oscilloscopes

BERTs

TDR/TDT

Spectrum analyzers

Precision probing

Job description

Qualcomm Technologies, Inc. seeks a Senior Lead High-speed Electrical/Optical Post-Silicon Engineer in San Diego to drive hands-on measurements and debug of 224G/448G interconnects across package, PCB, and system channels.

You will lead serdes/DDR validation, PDN debug, and cross-functional efforts with PHY, package, optics, firmware, and software teams, delivering automated validation content and robust design feedback.