Senior Leader, Electrical & Optical Systems Engineer

Qualcomm; San Diego (CA); On-site; USD 250,000 - 375,000; Full time

Benefits offered by this job

Annual bonus program

RSU grants

Competitive benefits package

Job summary

Qualcomm Technologies, Inc. seeks a Senior Leader, Electrical & Optical Systems Engineer to define and productize next-generation interconnect technologies for AI, hyperscale datacenter, networking and HPC systems.

You will lead architecture for 112G/224G SerDes, EIC/PIC integration, optical engines, and advanced packaging while guiding DSP, COM analysis and system-level modeling across multiple engineering disciplines.

Qualifications

• 15+ years in high-speed comms, networking or optical interconnects.
• Productization of 112G/224G PAM4 systems experience.
• Experience with 224G+ electrical/optical interconnects.

Responsibilities

• Define end-to-end interconnect architectures including 112G, 224G and emerging 448G SerDes.
• Lead design across SerDes, PHY, optical engines, substrates, PCB channels, connectors and CPC/NPC architectures.
• Own SI/PI methodology, channel budgeting, jitter and equalization strategy.
• Drive DSP architecture for TX/RX, CDR, adaptive filtering, FEC and impairment compensation.
• Develop system models and tradeoff studies for bandwidth, power, latency and cost.
• Provide technical leadership across silicon, packaging, optics, platform, and software.

Skills

High-speed SerDes

PAM4

SI/PI

EIC/PIC co-design

Optical engines

Co-packaged/near-packaged optics

System-level modeling

Python

MATLAB

Verilog/SystemVerilog

CPD/NPC architectures

Education

Bachelor's degree in Electrical Engineering or related field

Master's degree preferred

PhD beneficial

Tools

ADS

HFSS

CST

HSPICE

MATLAB

Python

Cadence Sigrity

Lumerical

Zemax

Verilog-A

SystemVerilog

COM analysis tools

IBIS-AMI modeling

Job description

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm Central Hardware Systems (CHS) team is seeking a Senior Leader, Electrical & Optical Systems Engineer to define, develop, and productize next-generation electrical and optical interconnect technologies for AI, hyperscale datacenter, networking, and HPC systems.

Impact:

Serve as a senior technical leader driving Qualcomm's transition from conventional PCB-based interconnects to NPC/CPC flyover architectures, co-packaged optics, silicon photonics, and EIC/PIC-integrated systems, enabling scalable AI infrastructure beyond 224G and toward 448G-per-lane technologies.

Key Responsibilities:

• Define and drive end-to-end architecture for next-generation interconnect solutions utilizing 112G, 224G, and emerging 448G SerDes technologies, Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Linear Pluggable Optics (LPO), Co-Packaged Connectors (CPC), Near-Package Connectors (NPC), copper and optical flyover architectures, Active Electrical Cables (AEC), and advanced optical interconnects.
• Lead system design and performance closure across SerDes and PHY architectures, EIC/PIC integration, optical engines, transceiver subsystems, advanced package substrates, PCB channels, connectors, cables, optics, power delivery, thermal, and mechanical architectures.
• Own SI/PI methodology and end-to-end link analysis including channel budgeting, COM analysis, jitter, crosstalk, insertion loss, return loss, equalization strategy, and simulation-to-silicon correlation.
• Drive electrical-optical DSP architecture and algorithm development including TX/RX equalization, CDR, adaptive filtering, FEC, impairment compensation, channel optimization, and overall system performance analysis.
• Develop system-level models and architecture tradeoff studies spanning bandwidth, reach, power, latency, reliability, manufacturability, cost, and scalability.
• Provide technical leadership across silicon, package, optics, platform, and software organizations while driving technology roadmaps and productization from concept through deployment.

Qualifications:

• Demonstrated success productizing 112G and/or 224G PAM4 electrical and optical communication systems.

Technical Expertise:

• High-speed SerDes architectures
• Electrical-optical DSP algorithms
• PAM4 communication systems
• Signal Integrity (SI) and Power Integrity (PI)
• EIC/PIC co-design and heterogeneous integration
• Optical transceivers and optical engines
• Co-packaged and near-packaged optics
• Advanced packaging, PCB, connector, cable, CPC, NPC, and flyover technologies
• End-to-end system modeling and architecture
• AI networking, scale-up, and scale-out infrastructures
• Hands-on experience with: ADS, HFSS, CST, HSPICE, MATLAB, Python, Cadence Sigrity, Lumerical, Zemax, Verilog-A, SystemVerilog, COM analysis tools, IBIS-AMI modeling

Preferred Qualifications

• MS or PhD in Electrical Engineering, Optical Engineering, Physics, or a related discipline.
• 15+ years of experience developing high-speed communication, networking, or optical interconnect products.
• Experience developing and productizing 224G+ electrical and optical interconnect solutions.
• Experience with CPO, NPO, CPC, NPC, flyover copper, flyover optical, silicon photonics, and EIC/PIC integration.
• Familiarity with Ethernet, PCIe, UALink, NVLink, OIF CEI, IEEE 802.3, and emerging AI interconnect standards.
• Experience with chiplets, UCIe, silicon photonics, 2.5D/3D integration, and advanced packaging technologies.
• Track record influencing industry standards, technology roadmaps, and large cross-functional architecture decisions.
• Proven success leading and mentoring senior technical teams across multiple engineering disciplines.

Minimum Qualifications:

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 10+ years of System/Package Design/Technology Engineering or related work experience.

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 9+ years of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ year of System/Package Design/Technology Engineering or related work experience.

Equal Opportunity Employer

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$249,900.00 - $374,900.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.