Senior IC Packaging Simulation Engineer (FEM/AI)

Apple, Inc.; Jackson (TN); On-site; USD 185,000 - 325,000; Full time

Job summary

Apple, Inc. is seeking a Packaging Simulation Engineer to perform FEM-based stress and deformation analyses of IC packages, enabling chip-package and package-board reliability.

You will script CAD/FEM workflows and apply Gen-AI/ML tools to automate model generation while collaborating across teams to ensure yield and product success. Ideal candidates have 10+ years in mechanical engineering, hands-on ANSYS/ABAQUS, MATLAB/Python, and solid knowledge of packaging materials and qualification

Qualifications

• BS in engineering with 10+ years of relevant experience.
• Extensive experience in FEM simulations of packages and reliability.
• Proficient in ANSYS, ABAQUS, and HyperMesh.

Responsibilities

• Model stress and deformation of IC packages to understand chip-package interactions.
• Assess reliability and yield risks through simulation during product definition.
• Support NPI and solve manufacturing-related issues from product development.
• Script CAD/FEM software and Gen-AI/ML tools to automate model generation.

Skills

FEM simulation

MATLAB

Python

Gen-AI / ML

Communication skills

Education

Bachelor's in Engineering

Tools

ANSYS

ABAQUS

HyperMesh

CAD scripting

Job description

Apple, Inc. is seeking a Packaging Simulation Engineer to perform FEM-based stress and deformation analyses of IC packages, enabling chip-package and package-board reliability.

You will script CAD/FEM workflows and apply Gen-AI/ML tools to automate model generation while collaborating across teams to ensure yield and product success. Ideal candidates have 10+ years in mechanical engineering, hands-on ANSYS/ABAQUS, MATLAB/Python, and solid knowledge of packaging materials and qualification