Senior IC Packaging Engineer - Thermal & Reliability Lead

Skyworks Solutions, Inc.; Irvine (CA); On-site; USD 114,000 - 220,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan with company match

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. in Irvine, CA is seeking an Advanced IC Packaging Staff Engineer to lead thermal and mechanical simulations for wireless packages, influence design decisions, and drive reliability from concept to production.

Join a fast-paced, collaborative team at the Irvine site, working on cutting-edge packaging technologies and cross-functional projects that impact performance, yield, and cost while enjoying the Southern California lifestyle.

Qualifications

• BS with 8+ years, MS with 6+ years, or PhD with 3+ years in Mechanical Engineering or related field.
• Strong fundamentals in solid mechanics, heat transfer, materials science, and reliability engineering.
• Hands-on experience with finite element analysis (FEA) tools such as ANSYS (APDL and Workbench), Icepak, ABAQUS, FloTHERM, COMSOL, or equivalent simulation platforms.
• Proven experience in IC package modeling and simulation, including stress, strain, warpage, thermal performance, and reliability assessments.
• Experience modeling package assembly processes such as die attach, wire bonding, molding, curing, and board-level assembly, as well as reliability test conditions including thermal cycling, drop/shock, and mechanical bending.

Responsibilities

• Develop detailed thermo-mechanical finite element models (FEM) of IC packages to evaluate stress, strain, and deformation induced by package assembly processes.
• Perform mechanical reliability simulations to characterize package behavior under accelerated reliability test conditions, including thermal cycling, THB, power cycling, and mechanical loading.
• Setup moldflow simulation models to predict molding process risks including mold fillability, mold pressure distribution, warpage etc.
• Perform second level reliability simulations to predict solder joint lifetimes under thermal cycling, drop/shock and cyclic bending load conditions.
• Create, maintain, and document simulation methodologies, modeling procedures, automation scripts, and analysis workflows; communicate results to cross-functional teams.
• Collaborate with material suppliers, test labs, and internal teams to obtain material properties for accurate thermal and mechanical modeling.

Skills

Thermal simulation

Mechanical simulation

FEM analysis

IC packaging

Cross-functional teams

Communication skills

Education

BS with 8+ years in Mechanical Eng

MS with 6+ years in Mechanical Eng

PhD with 3+ years in Mechanical Eng

Tools

ANSYS

Icepak

ABAQUS

FloTHERM

COMSOL

Job description

Skyworks Solutions, Inc. in Irvine, CA is seeking an Advanced IC Packaging Staff Engineer to lead thermal and mechanical simulations for wireless packages, influence design decisions, and drive reliability from concept to production.

Join a fast-paced, collaborative team at the Irvine site, working on cutting-edge packaging technologies and cross-functional projects that impact performance, yield, and cost while enjoying the Southern California lifestyle.