IC Packaging: Thermal/Mechanical Simulation Co-op

Skyworks Solutions, Inc.; Irvine, Northern (CA, KY); Hybrid; USD 36,000 - 65,000; Part time

Job summary

Skyworks Solutions, Inc. in Irvine is seeking an IC Packaging Thermal / Mechanical Simulation Co-op for Winter/Spring 2027. You will work with engineers on IC packaging processes, learn ANSYS FEA, and contribute to thermal and mechanical analyses.

This paid internship offers cross-functional collaboration, basic automation scripting in Python, and reporting on simulation findings while gaining exposure to semiconductor packaging technologies.

Qualifications

• The student is pursuing a Ph.D. in a related engineering field.
• Strong fundamentals in mechanics and heat transfer.
• Exposure to CAD/FEA/Python or similar software is a plus.
• Analytical, problem-solving, and communication skills are essential.
• Interest in semiconductor packaging and simulation methodologies.

Responsibilities

• Work with engineers to understand package structures, materials, and manufacturing processes used in semiconductor packaging.
• Learn and use finite element analysis (FEA) tools such as ANSYS to evaluate package behavior under thermal and mechanical loading conditions.
• Support analysis of package warpage, stress, deformation, and temperature distribution.
• Help prepare engineering reports, presentations, and summaries of simulation findings.
• Develop basic automation scripts or data analysis tools using ANSYS APDL scripting / Python or similar software.
• Collaborate with cross-functional teams including package design, reliability, process, and product engineers.

Skills

Strong analytical skills

Problem-solving

Communication skills

Eagerness to learn

Education

Ph.D. in Mechanical Engineering or related field

Tools

ANSYS

Python

CAD

FEA

Job description

Skyworks Solutions, Inc. in Irvine is seeking an IC Packaging Thermal / Mechanical Simulation Co-op for Winter/Spring 2027. You will work with engineers on IC packaging processes, learn ANSYS FEA, and contribute to thermal and mechanical analyses.

This paid internship offers cross-functional collaboration, basic automation scripting in Python, and reporting on simulation findings while gaining exposure to semiconductor packaging technologies.