Senior IC Packaging Engineer: High-Speed & Thermal Design

ASE US Inc

Sunnyvale (CA)

On-site

USD 120,000 - 160,000

Full time

2 days ago
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Benefits offered by this job

Medical insurance
Vision insurance
401(k) Plan

Job summary

ASE (U.S.) INC. in Sunnyvale, CA is seeking a Sr. Application Engineer responsible for supporting customers, guiding IC packaging design and working with ASE factory teams to maintain production yields. The role focuses on meeting customer roadmaps and maintaining ASE leadership in the semiconductor market.

The position requires a BS in Engineering and 8+ years in IC packaging/assembly, with strong knowledge of packaging rules and QA processes. Fluency in English is essential, Mandarin a plus.

Qualifications

  • BS degree in Engineering or a related field.
  • 8+ years of experience in IC packaging and IC assembly.
  • Strong knowledge of IC packaging design rules and QA processes.

Responsibilities

  • Review customers’ devices and feedback to engineering team for IC packages developing to meet specific applications needs.
  • Co-work with manufacturing team from new designs into volume productions.
  • Work closely with R&D groups to develop an advanced package for high speed /high-performance applications.
  • Understand IC package thermal electrical & stress characterization & modeling.
  • Collect technical & marketing information for process engineering & R&D groups to develop advanced packages.
  • Follow up engineering issues with customers and manufacturing team.

Skills

MS Outlook
MS Word
MS Excel
PowerPoint
Communication skills
Cross-functional collaboration

Education

Bachelor's degree in Engineering

Job description

ASE (U.S.) INC. in Sunnyvale, CA is seeking a Sr. Application Engineer responsible for supporting customers, guiding IC packaging design and working with ASE factory teams to maintain production yields. The role focuses on meeting customer roadmaps and maintaining ASE leadership in the semiconductor market.

The position requires a BS in Engineering and 8+ years in IC packaging/assembly, with strong knowledge of packaging rules and QA processes. Fluency in English is essential, Mandarin a plus.

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