Senior IC Package Mechanical FEA Engineer (3DIC/FCBGA)

Broadcom; Fort Collins (CO); On-site; USD 108,000 - 173,000; Full time

Benefits offered by this job

Medical benefits

401K match

ESPP program

Paid time off

Dental & Vision

Job summary

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex ASIC packages. You will join a global R&D team developing high-performance package designs for AI, networking, HPC, and 5G base stations.

The role covers co-packaged fiber-optic transceivers, 3DIC integration, and multi-chip modules. You will drive reliability, warpage, and thermal performance through advanced modeling and experimental validation.

Qualifications

• Bachelors in Mechanical Engineering or similar field with 8+ years in FEA modeling.
• Ability to evaluate complex numerical results against first principles.
• Ability to calibrate modeling with empirical data.

Responsibilities

• Design responsibility for mechanical design of ASIC packages.
• Use advanced FEA to quantify and optimize reliability and manufacturing.
• Measure and experiment to validate understanding and improve model accuracy.
• Collaborate with package designers, reliability and manufacturing partners.
• Schedule, prioritize, & track work across 4+ projects simultaneously.
• Create presentations for engineers, managers, senior management, customers, and vendors.
• Document design rules and guidelines.

Skills

FEA modeling

Ansys

Mechanical design

Education

Bachelor's in Mechanical Engineering

Master's in Mechanical Engineering

PhD in Mechanical Engineering

Tools

Ansys Classic/Mechanical

Job description

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex ASIC packages. You will join a global R&D team developing high-performance package designs for AI, networking, HPC, and 5G base stations.

The role covers co-packaged fiber-optic transceivers, 3DIC integration, and multi-chip modules. You will drive reliability, warpage, and thermal performance through advanced modeling and experimental validation.