Senior ASIC Package Design Project Manager

Broadcom; Fort Collins (CO); On-site; USD 140,000 - 190,000; Full time

Job summary

Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for AI, networking, HPC, and 5G applications. You will drive high-speed SerDes and power-delivery designs and contribute to advanced packaging methodologies.

You will create and track plans for 20+ concurrent designs, coordinate with global teams and customers, and steer package design methodologies.

Qualifications

• Bachelor's degree and 12+ years experience in package design.
• Knowledge of package-level signal integrity and power integrity.
• Cooperate with our world-wide team across multiple time zones.
• Self-management and organization skills.
• Technical understanding related to package design.

Responsibilities

• Create and track project plans for 20+ concurrent designs (scope, schedules, resources).
• Improve scheduling methodologies and task tracking and coordination.
• Organize team and customer activities to keep projects on track.
• Communicate plans, status, next steps and risks.
• Create technical methodologies for package design.
• Steering package technology and design rules, with input from team members.
• Customer, vendor, and cross-functional collaboration.

Skills

Package design

Project management

Cross-functional collaboration

Communication

Time management

Education

Bachelor's degree, 12+ years exp

Master's degree, 10+ years exp

Job description

Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for AI, networking, HPC, and 5G applications. You will drive high-speed SerDes and power-delivery designs and contribute to advanced packaging methodologies.

You will create and track plans for 20+ concurrent designs, coordinate with global teams and customers, and steer package design methodologies.