IC Package Mechanical FEA Engineer (R&D)

Broadcom; Fort Collins (CO); On-site; USD 108,000 - 173,000; Full time

Benefits offered by this job

Medical benefits

401K match

ESPP program

Paid time off

Dental & Vision

Job summary

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex ASIC packages. You will join a global R&D team developing high-performance package designs for AI, networking, HPC, and 5G base stations.

The role covers co-packaged fiber-optic transceivers, 3DIC integration, and multi-chip modules. You will drive reliability, warpage, and thermal performance through advanced modeling and experimental validation.

Qualifications

• Bachelors in Mechanical Engineering or similar field with 8+ years in FEA modeling.
• Ability to evaluate complex numerical results against first principles.
• Ability to calibrate modeling with empirical data.

Responsibilities

• Design responsibility for mechanical design of ASIC packages.
• Use advanced FEA to quantify and optimize reliability and manufacturing.
• Measure and experiment to validate understanding and improve model accuracy.
• Collaborate with package designers, reliability and manufacturing partners.
• Schedule, prioritize, & track work across 4+ projects simultaneously.
• Create presentations for engineers, managers, senior management, customers, and vendors.
• Document design rules and guidelines.

Skills

FEA modeling

Ansys

Mechanical design

Education

Bachelor's in Mechanical Engineering

Master's in Mechanical Engineering

PhD in Mechanical Engineering

Tools

Ansys Classic/Mechanical

Job description

USA-Colorado-Fort Collins-4380 Ziegler Road

USA-CA San Jose Innovation Drive

Full time

Job Description:

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc.

RESPONSIBILITIES:

• Design responsibility for mechanical design aspects of ASIC packages
• Use advanced FEA to quantify and optimize reliability and manufacturing
• Measure and experiment to validate understanding and improve model accuracy
• Collaborate closely with package designers, reliability and manufacturing partners (internal and external)
• Schedule, prioritize, & track your work across 4+ projects simultaneously
• Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors
• Document design rules and guidelines

EDUCATION/EXPERIENCE & REQUIREMENTS:

• Bachelors in Mechanical Engineering or similar field and 8+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 6+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 3+ years of experience in FEA modeling.
• Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions
• Ability to calibrate modeling and results with existing empirical data
• Perform mechanical testing and measurement
• Devise lab scale tests to validate analyses
• Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations
• Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
• Self-management and organization skills
• Presentation and technical documentation skills

Compensation and Benefits

The annual base salary range for this position is $108,000 - $172,800.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

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