Senior High-Speed PCB Layout Engineer

Energy Jobline ZR; Redmond (WA); In loco; USD 117.000 - 178.000; Tempo pieno

Descrizione del lavoro

HCLTech is seeking an experienced PCB Layout Engineer in Redmond, WA to design and develop complex multilayer PCBs for compute, networking, wireless, and embedded platforms. You will lead from concept through manufacturing release with Cadence Allegro and high-speed interfaces, collaborating with front-end engineers and fabrication vendors.

The role emphasizes control impedance routing, RF, power electronics, and advanced PCB technologies such as microvias and back-drills.

Competenze

• 5+ years of PCB layout experience using Cadence Allegro.
• Experience with DDR3/4/5, PCIe, USB 3.x, HDMI, DisplayPort, SATA, SGMII, and high-speed interfaces.
• Experience designing boards based on Intel, AMD, and Qualcomm SoCs.
• Hands-on experience with Rigid, Flex, and Rigid-Flex PCB designs.
• Strong knowledge of controlled impedance routing, RF, analog, power designs, and high-speed motherboard layouts.
• Experience with advanced PCB technologies such as back-drill, microvias, blind/buried vias, stacked/staggered vias.
• Knowledge of PCB manufacturing, DFM/DFT, IPC standards, and Gerber verification using CAM350.
• Ability to create symbols, footprints, define stackups, and collaborate with PCB fabrication vendors.
• Strong understanding of schematics, component datasheets, and power electronics.

Mansioni

• Drive designs from concept through manufacturing release.
• Develop and validate multilayer PCB solutions for next-generation hardware.

Conoscenze

PCB Layout

Cadence Allegro

High-speed interfaces

DDR3/4/5

PCIe

USB 3.x

HDMI

DisplayPort

SATA

SGMII

Wi-Fi 6/6E/7

SoC integration

Rigid/Flex

DFM/DFT

IPC standards

CAM350

Symbols/Footprints

Power electronics

Stackups

Strumenti

CAM350

Descrizione del lavoro

HCLTech is seeking an experienced PCB Layout Engineer in Redmond, WA to design and develop complex multilayer PCBs for compute, networking, wireless, and embedded platforms. You will lead from concept through manufacturing release with Cadence Allegro and high-speed interfaces, collaborating with front-end engineers and fabrication vendors.

The role emphasizes control impedance routing, RF, power electronics, and advanced PCB technologies such as microvias and back-drills.