Senior PCB Layout Engineer - High-Speed Multilayer

HCLTech; Redmond (WA); On-site; USD 117,000 - 178,000; Full time

Job summary

HCLTech in Redmond, WA is seeking a highly talented PCB Layout Engineer to design and develop complex multilayer PCBs for next-generation computing, networking, wireless, and embedded hardware platforms.

You will use Cadence Allegro, handle high-speed interfaces, and drive designs through concept to manufacturing release, collaborating with fabrication vendors while following IPC/DFM standards.

Qualifications

• 5+ years of PCB layout experience using Cadence Allegro.
• Experience with DDR3/4/5, PCIe, USB 3.x, HDMI, DisplayPort, SATA, SGMII, Wi-Fi 6/6E/7 and high-speed digital interfaces.
• Experience designing boards based on Intel, AMD, and Qualcomm SoCs.
• Hands-on experience with Rigid, Flex, and Rigid-Flex PCB designs.
• Strong knowledge of controlled impedance routing, RF, analog, power designs, and high-speed motherboard layouts.
• Knowledge of PCB manufacturing, DFM/DFT, IPC standards, and Gerber verification using CAM350.

Responsibilities

• Design and develop complex multilayer PCB solutions for computing, networking and embedded hardware.
• Drive designs from concept through manufacturing release.
• Create symbols, footprints, define stackups and collaborate with fabrication vendors.

Skills

PCB layout

High-speed interfaces

Power electronics

DFM/DFT

Tools

Cadence Allegro

CAM350

Gerber

Job description

HCLTech in Redmond, WA is seeking a highly talented PCB Layout Engineer to design and develop complex multilayer PCBs for next-generation computing, networking, wireless, and embedded hardware platforms.

You will use Cadence Allegro, handle high-speed interfaces, and drive designs through concept to manufacturing release, collaborating with fabrication vendors while following IPC/DFM standards.