Senior High-Density PCB Design Engineer

Apex Systems; Cincinnati (OH); Presencial; USD 83.000 - 110.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical insurance

Dental insurance

Vision insurance

401k with company match

Employee stock purchase program (ESPP)

HSA with HDHP plan

Descripción de la vacante

Everforth Apex in Cincinnati, OH is seeking an experienced circuit design engineer to lead the layout of high-density PCBs including RF and high-speed sections. You will translate schematics into optimized, manufacturable boards and generate complete fabrication packages.

The role requires 8–12 years in PCB design, expertise with Xpedition, and collaboration across engineering teams to address signal integrity, power integrity, and thermal challenges.

Formación

• Bachelor, Master, or PhD in a relevant engineering discipline; 8–12 years PCB engineering/layout experience.
• Extensive experience with multi-layer, high-density boards and high-speed digital/RF/mixed-signal circuits.
• Experience using Xpedition for layout and documentation generation.

Responsabilidades

• Place and route complex, high-density PCBs with high-speed digital/RF/mixed-signal sections.
• Interpret schematics and constraints to create optimized, manufacturable layouts.
• Produce fabrication and assembly documentation packages (artwork, drawings, notes, data outputs).
• Apply industry standards in PCB design and verification for reliability and performance.
• Collaborate across electrical, mechanical, manufacturing, and signal integrity teams.
• Support DFx reviews and work with suppliers to incorporate manufacturing constraints.
• Manage layout tasks from concept to fabrication data release to meet schedule.

Conocimientos

PCB layout

High-density PCBs

RF/high-speed circuits

Xpedition

Educación

B.S./M.S./PhD in engineering

Herramientas

Xpedition

Descripción del empleo

Everforth Apex in Cincinnati, OH is seeking an experienced circuit design engineer to lead the layout of high-density PCBs including RF and high-speed sections. You will translate schematics into optimized, manufacturable boards and generate complete fabrication packages.

The role requires 8–12 years in PCB design, expertise with Xpedition, and collaboration across engineering teams to address signal integrity, power integrity, and thermal challenges.