Senior HBM DFT Design Engineer — Tape-out & Test

Micron Technology, Inc.; Texas; On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical benefits

Dental plan

Vision plan

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking a Senior Engineer - HBM Design for Test (DFT) to lead DFT definition, implementation, integration, and support across HBM die.

You will drive DFT architectures, contribute to specifications, and partner with cross‑functional teams to ensure testability, quality, and manufacturability for current and next‑gen HBM products. The role requires hands‑on experience in DFT features, silicon bring‑up, and tape‑out support, with strong collaboration across Architecture,

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years of semiconductor development with exposure to DFT, design, verification, test, or silicon debug.
• 1+ years of experience in memory architectures (HBM or DRAM preferred).
• 1+ years of experience implementing DFT features and supporting DFT‑related debug and bring‑up activities.

Responsibilities

• Implement and integrate DFT features for assigned HBM core die and base die designs in alignment with established DFT architecture and guidelines.
• Contribute to the development, review, and maintenance of DFT specifications, requirements, and implementation guidelines.
• Ensure DFT implementations support high‑quality, efficient, and manufacturable HBM products.
• Collaborate with Design Engineering, Product Engineering, Test, and DFT Verification to translate manufacturing and test requirements into actionable DFT implementations; support alignment between DFT specs and verification coverage.

Skills

DFT design

Memory architectures

Silicon debug

Cross-functional collaboration

Education

Bachelor's degree in Electrical Engineering

Master's degree preferred

Tools

DFT tooling

Job description

Micron Technology, Inc. is seeking a Senior Engineer - HBM Design for Test (DFT) to lead DFT definition, implementation, integration, and support across HBM die.

You will drive DFT architectures, contribute to specifications, and partner with cross‑functional teams to ensure testability, quality, and manufacturability for current and next‑gen HBM products. The role requires hands‑on experience in DFT features, silicon bring‑up, and tape‑out support, with strong collaboration across Architecture,