HBM DFT Engineer — Tape-Out & Test Innovation

Micron Technology, Inc.; Richardson (TX); On-site; USD 140,000 - 200,000; Full time

Job summary

Micron Technology, Inc. seeks an Engineer – HBM Design for Test (DFT) to define, implement, integrate, and support DFT solutions across HBM cores and base dice for current and next-gen products.

The role drives defined DFT architectures, collaborates with multi-functional teams, and ensures DFT features meet test, quality, and manufacturability requirements, supporting tape-out, silicon bring‑up, and qualification.

Qualifications

• Bachelor’s degree in Electrical Engineering or related field (Master’s preferred).
• Experience in semiconductor development with exposure to DFT, design, verification, or silicon debug.
• Working knowledge of memory architectures (HBM or DRAM) and DFT feature implementation.

Responsibilities

• Implement and integrate DFT features for assigned designs per DFT architecture.
• Develop, review, and maintain DFT specs and implementation guidelines.
• Coordinate with Design Eng, Product Eng, Test and Verification to align requirements.
• Identify, debug, and resolve DFT-related issues during build, tape-out, bring-up.
• Document DFT implementations and procedures for knowledge sharing.

Skills

DFT expertise

Cross-functional collaboration

Communication skills

Education

Bachelor's degree in Electrical Engineering

Master's degree preferred

Job description

Micron Technology, Inc. seeks an Engineer – HBM Design for Test (DFT) to define, implement, integrate, and support DFT solutions across HBM cores and base dice for current and next-gen products.

The role drives defined DFT architectures, collaborates with multi-functional teams, and ensures DFT features meet test, quality, and manufacturability requirements, supporting tape-out, silicon bring‑up, and qualification.