HBM DFT Engineer – Design for Test & Silicon Bring-Up

Micron Technology, Inc

Richardson (TX)

In loco

USD 120.000 - 165.000

Tempo pieno

14 giorni+
Generatore di candidature

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Descrizione del lavoro

Micron Technology, Inc. is seeking an Engineer – HBM Design for Test (DFT) to define, implement, and support DFT across HBM core and base dies for current and next-gen products.

The role emphasizes driving DFT architectures, contributing to specifications, and partnering with multi-functional teams to meet test, quality, and manufacturability requirements from tape-out through silicon bring-up.

Competenze

  • Bachelor’s degree in Electrical Engineering or related field.
  • Experience in semiconductor development with exposure to DFT and test.
  • Working knowledge of memory architectures (HBM preferred).
  • Experience implementing DFT features and supporting DFT-related debug and bring-up activities.

Mansioni

  • Implement and integrate DFT features for HBM die designs per established architecture and guidelines.
  • Contribute to DFT specifications, requirements, and implementation guidelines.
  • Ensure DFT implementations support high-quality, manufacturable HBM products.
  • Collaborate with Design Engineering, Product Engineering, Test, and DFT Verification to translate requirements into DFT implementations.
  • Identify, debug, and resolve DFT-related issues during build, tape-out, and silicon bring-up.
  • Document DFT implementations and procedures for knowledge sharing.

Conoscenze

DFT design
HBM memory
Silicon debug
Memory architectures

Formazione

Bachelor’s in Electrical Engineering
Master’s preferred

Strumenti

AI tools

Descrizione del lavoro

Micron Technology, Inc. is seeking an Engineer – HBM Design for Test (DFT) to define, implement, and support DFT across HBM core and base dies for current and next-gen products.

The role emphasizes driving DFT architectures, contributing to specifications, and partnering with multi-functional teams to meet test, quality, and manufacturability requirements from tape-out through silicon bring-up.

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