HBM DFT Design Engineer for Tape-out

Micron Technology; Richardson (TX); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Medical plans

Dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology is seeking an Engineer – HBM Design for Test (DFT) to define, implement, and support DFT solutions across HBM core die and base die for current and next-gen memory products.

The role emphasizes working with DFT Architecture, Design Engineering, Product Engineering, Test, and Verification to ensure testability, quality, and manufacturability from tape-out to qualification.

Qualifications

• Bachelor’s degree in Electrical Engineering or related field; Master’s preferred.
• Experience in semiconductor development with exposure to DFT, design, verification, test, or silicon debug.
• Working knowledge of memory architectures (HBM or DRAM preferred) and DFT feature implementation.

Responsibilities

• Implement and integrate DFT features for assigned HBM core die and base die designs in alignment with established DFT architecture and guidelines.
• Contribute to development, review, and maintenance of DFT specifications and implementation guidelines.
• Ensure DFT implementations support high-quality, manufacturable HBM products.
• Collaborate with Design Engineering, Product Engineering, Test, and DFT Verification on requirements, coverage, and issue resolution during build, tape-out, and silicon bring-up.
• Serve as a DFT contributor or sub-domain owner for assigned programs or functional areas.
• Support reuse and standardization of DFT logic across HBM products under leadership mentorship.
• Participate in design, verification, and readiness reviews, providing technical guidance and issue resolution support.
• Document DFT implementations, lessons learned, and procedures for knowledge sharing.

Skills

DFT

Memory architectures

HBM

AI tools

Education

Bachelor’s degree in Electrical Engineering

Master’s preferred

Tools

AI tools

Job description

Micron Technology is seeking an Engineer – HBM Design for Test (DFT) to define, implement, and support DFT solutions across HBM core die and base die for current and next-gen memory products.

The role emphasizes working with DFT Architecture, Design Engineering, Product Engineering, Test, and Verification to ensure testability, quality, and manufacturability from tape-out to qualification.