Senior Failure Analysis Engineer - 3D Packaging Metrology

University of Texas at Austin

Austin (TX)

On-site

USD 90,000 - 140,000

Full time

13 days ago

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Job summary

The University of Texas at Austin's Texas Institute for Electronics at the Pickle Research Campus seeks a Failure Analysis Engineer/Senior Failure Analysis Engineer to lead surface characterization of complex 3D semiconductor packages and collaborate with customers across engineering disciplines.

The role involves setting up and maintaining the characterization facility, driving root-cause analysis to optimize processes, and contributing to lab capability development while working with industry

Qualifications

MS or PhD in a related field with relevant experience in surface science characterization tools.
Proven track record of establishing and managing advanced research facilities.
Excellent problem-solving skills and ability to work both independently and with teams.
Strong communication skills to interact with customers and team members.
Demonstrated ability to innovate and develop new metrologies.

Responsibilities

Establish and manage surface science characterization tools for advanced package failure analysis.
Set up and oversee the characterization facility at the Montopolis campus, including procurement and installation of equipment.
Identify root causes of failures to optimize processes and improve yield in early production.
Stay current with industry trends and developments in metrology.
Collaborate with external vendors and academic partners to advance lab capabilities.
Document design processes and results through reports and methodologies.
Perform other related functions as assigned.