Senior Failure Analysis Engineer – 3D Packaging Metrology

University of Texas

United States

On-site

USD 90,000 - 140,000

Full time

14 days+
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Benefits offered by this job

Competitive health benefits
Paid time off
Tuition assistance

Job summary

University of Texas at Austin seeks a Failure Analysis Engineer to advance surface characterization of 3D semiconductor packages and lead the setup of a dedicated failure analysis facility at the Pickle Research Campus. You will work with cross-functional teams, customers, and vendors to push metrology capabilities and improve yield.

The role emphasizes independent problem solving, collaboration with industry partners, and ongoing lab development in a dynamic research environment.

Qualifications

  • M.S. in Materials Science, Physics, Mechanical Engineering or related field; experience with surface science characterization tools
  • Experience establishing and managing advanced research facilities
  • Strong problem-solving and communication skills; able to work independently and with customers

Responsibilities

  • Establish and manage surface science characterization tools for advanced package failure analysis.
  • Set up the characterization facility at Montopolis campus, including planning, procurement and equipment installation.
  • Identify root causes of failures to enable process and yield improvements in early production.
  • Stay updated on industry trends and metrology advancements for lab capabilities.
  • Collaborate with vendors and academic partners to develop advanced characterization techniques.
  • Document processes and results via Metrology Capability Reports and Best Known Methodologies.

Skills

Surface analysis
Root cause analysis
Independent work
Problem solving

Education

M.S. in Materials Science/Physics/Mechanical Engineering
M.S./Ph.D. with surface science focus

Tools

Surface characterization instruments

Job description

University of Texas at Austin seeks a Failure Analysis Engineer to advance surface characterization of 3D semiconductor packages and lead the setup of a dedicated failure analysis facility at the Pickle Research Campus. You will work with cross-functional teams, customers, and vendors to push metrology capabilities and improve yield.

The role emphasizes independent problem solving, collaboration with industry partners, and ongoing lab development in a dynamic research environment.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior Failure Analysis Engineer - Package Metrology
Senior Failure Analysis Engineer - Package Metrology

The University of Texas at Austin • Austin (TX)

On-site
USD 105,000 - 160,000
Competitive health benefits
Tuition assistance
Flexible spending account options
+2
Senior Product Engineer — 3D Packaging & Yield Impact
Senior Product Engineer — 3D Packaging & Yield Impact

University of Texas • Austin (TX)

On-site
USD 90,000 - 140,000
Competitive benefits package
LinkedIn Learning access
Tuition assistance
+1
Senior Failure Analysis Lab Technician - Semiconductors
Senior Failure Analysis Lab Technician - Semiconductors

University of Texas at Austin • Austin (TX)

On-site
USD 85,000 - 120,000
Senior Metrology Engineer - 3DHI & Packaging R&D
Senior Metrology Engineer - 3DHI & Packaging R&D

The University of Texas at Austin • Austin (TX)

On-site
USD 90,000 - 110,000
Lead Failure Analysis Engineer – FIB/SEM
Lead Failure Analysis Engineer – FIB/SEM

Sheetak, Inc. • Austin (TX)

On-site
USD 90,000 - 120,000
Product Engineer I: 3DIC Packaging & Test Validation
Product Engineer I: 3DIC Packaging & Test Validation

The University of Texas at Austin • Austin (TX)

On-site
USD 90,000 - 150,000
Health benefits
Tuition assistance
LinkedIn Learning access
Senior Packaging Failure Analysis Engineer (MEMS/Photonics)
Senior Packaging Failure Analysis Engineer (MEMS/Photonics)

nEye Systems, Inc. • Santa Clara (CA)

Hybrid
USD 165,000 - 220,000
Failure Analysis (F/A) Engineer
Failure Analysis (F/A) Engineer

Sheetak, Inc. • Austin (TX)

On-site
USD 90,000 - 120,000
Semiconductor Equipment Engineer – Packaging & Lithography
Semiconductor Equipment Engineer – Packaging & Lithography

University of Texas • United States

On-site
USD 90,000 - 120,000
Competitive health benefits
Tuition assistance
Paid time off
+1
3D Packaging Engineer - Advanced Packaging Innovator
3D Packaging Engineer - Advanced Packaging Innovator

Advanced Micro Devices • Austin (TX)

On-site
USD 120,000 - 170,000