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University of Texas at Austin seeks a Failure Analysis Engineer to advance surface characterization of 3D semiconductor packages and lead the setup of a dedicated failure analysis facility at the Pickle Research Campus. You will work with cross-functional teams, customers, and vendors to push metrology capabilities and improve yield.
The role emphasizes independent problem solving, collaboration with industry partners, and ongoing lab development in a dynamic research environment.
University of Texas at Austin seeks a Failure Analysis Engineer to advance surface characterization of 3D semiconductor packages and lead the setup of a dedicated failure analysis facility at the Pickle Research Campus. You will work with cross-functional teams, customers, and vendors to push metrology capabilities and improve yield.
The role emphasizes independent problem solving, collaboration with industry partners, and ongoing lab development in a dynamic research environment.