Senior ESD & Latch-Up Architect for HBM & 3D IC

1000 Micron Technology, Inc.; Folsom (CA); On-site; USD 177,000 - 334,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off

Job summary

1000 Micron Technology, Inc. is searching for a skilled SMTS/DMTS HBM ESD/Latch‑Up Architect who will define protection strategies across base die, DRAM stacks, and interconnects. This role demands a solid background in electrical engineering, particularly in ESD design and advanced CMOS technologies.

The position offers an annual base salary range of $177,000 to $334,000. Benefits include medical, dental, and vision plans, alongside paid family leave and holidays.

Qualifications

• 10+ years of experience in ESD and latch‑up design and reliability.
• Expertise in advanced CMOS technologies such as FinFET or GAA.
• Experience with 3D IC, TSV, or die‑to‑die interfaces.

Responsibilities

• Define end‑to‑end ESD and latch‑up architecture across base die, DRAM die, and interconnects.
• Develop protection strategies for high‑speed I/O, TSV interfaces, and advanced packaging.
• Establish ESD/LUP standards, rule decks, and sign‑off criteria.

Skills

ESD and latch‑up design

Advanced CMOS technologies (FinFET, GAA)

3D IC and TSV interfaces

Technical leadership

Education

MS or PhD in Electrical Engineering or related field

Job description

1000 Micron Technology, Inc. is searching for a skilled SMTS/DMTS HBM ESD/Latch‑Up Architect who will define protection strategies across base die, DRAM stacks, and interconnects. This role demands a solid background in electrical engineering, particularly in ESD design and advanced CMOS technologies.

The position offers an annual base salary range of $177,000 to $334,000. Benefits include medical, dental, and vision plans, alongside paid family leave and holidays.